JAPAN JUKI Pick And Place Machine Rs-2 For Smt Smd Pcba Led Bulb Assembly Machine

50,000CPH high speed
The laser sensor approaches the substrate, shortening the movement time from suction to mounting, thereby achieving the ultra-high speed of a single-head
soldering machine at 50,000CPH*.
*Under optimal conditions
The "匠HEAD" with variable sensor height
The "匠HEAD" equipped with 8 suction nozzles， the laser sensor that recognizes the shape of the component can automatically change its own height and suction， and mount.
Realizes the mounting of components of different heights， from extremely small components to large components， at the optimal cycle.
Laser recognition technology
Can recognize various component shapes， from the smallest component 03015 to the 50mm x 150mm BGA， SOP， QFP， etc. Laser recognition is not affected by deviations in the shape and luster of the electrodes， achieving stable recognition and mounting. Additionally， generating component data is simple， so new component information can be quickly created.
Wide component compatibility
The applicable range of component sizes is from 03015 to 674mm， and 50mm x 150mm can also be accommodated. The maximum component height can be 25mm， and is widely applicable to various component mounting.
Can install 112 feeders
The RF feeder， characterized by small size， light weight， and thinness， can install up to 112 feeders (total front and rear)， reducing the number of preparations and suitable for various components， achieving efficient production of multi-variety small-batch. *When using the RF feeder (RF08AS)
New coplanar detection sensor
Can detect pin elements with pin floating， BGA with solder ball deformation， preventing bad-mounted components. By implementing high-precision coplanar detection， the reliability of the product can be further enhanced. Product Specifications
High-speed intelligent modular surface mount machine RS-2
Board size Minimum 50 mm × 50 mm
Maximum 1 cache 800 mm × 370 mm
3 caches 410 mm × 370 mm
Board allowable weight Maximum 3 kg
Board thickness 0.3 - 6.0 mm
Maximum component height 25 mm
Component size 03015 - 50 mm × 150 mm (1 × 3 recognition) □ 74 mm (2 × 2 recognition)
Component mounting speed Optimal conditions 50,000 CPH
IPC9850 32,000 CPH
Component mounting accuracy ±35 μm (Cpk ≥ 1)
Maximum component mounting quantity 112 types * 1
Power supply Three-phase AC 200V (standard specification) / Three-phase AC 200V - 415V (transformer specification selectable)
Rated power 2.2 kVA
Air pressure usage 0.5 ± 0.05 MPa
Maximum air consumption (standard state) Using vacuum generator: 200 L/min (standard), Using vacuum pump: 50 L/min (optional)
Overall dimensions (W × D × H) * 2 1,500 mm × 1,686 mm × 1,450 mm
Body weight Approximately 1,630 kg