YFX Machine - Professional SMT machine manufacturer providing one-stop solution.
The PCB spraying process mainly consists of two core processes: anti-corrosion paint coating and tin spraying, which are respectively used for protection and enhanced welding. The specific process involves key steps such as pre-treatment, spraying operation, curing, and post-treatment.
Three-anti-corrosion paint coating process flow
Preprocessing.
Cleaning: Use a dedicated cleaning agent or ultrasonic waves to remove oil, dust and ionic contamination from the PCB surface (standard requirement: ≤ 1.56 μg/cm²). 2
Baking the board: Preheat at 60℃ for 10-20 minutes to remove moisture and enhance the adhesion of the coating. 3 4
Shading: The non-coated areas (such as connectors) are protected using tape or a laser mask (with an accuracy of 50 μm). 2 4
Application implementation.
Method Selection:
Brush coating / Dip coating: Suitable for simple board shapes, but with low material utilization rate (dip coating loss reaches 40%). 2
Selective Spraying: Accuracy ± 0.1mm, suitable for components below 0402 or high-density boards. 2 5
Parameter Control: The spraying thickness is usually 25-75 μm. Be sure to avoid run-off or bubbles. 4 6
Solidification and Inspection.
Curing method: UV curing (dries within 3-5 seconds), thermal curing (gradually heated to 120℃), or moisture curing (humidity 40-60% RH). 2
Quality verification: Through X-ray thickness measurement (with an accuracy of ±1 μm) and salt spray test (no corrosion after 72 hours), etc. 2
Soldering process (HASL)
Preprocessing.
Micro-etching: Sodium peroxide solution corrodes the copper surface by 0.5 - 1 μm, enhancing the adhesion of the tin layer. 7 8
Soldering agent application: Uniform spraying to enhance the wetting property of the solder solution. 7
Soldering operation.
Immersion in tin: Immerse in tin solution at 265 ± 5℃ for 3 to 5 seconds (for lead-free process, it is a Sn96.5/Ag3/Cu0.5 alloy). 8
Hot air leveling: Using a high-pressure air knife at 280-300℃ to level the tin layer, with a thickness controlled at 1-3 μm. 8 9
Post-processing.
Cooling: Rapid cooling (> 4°C/second) is performed to stabilize the structure of the tin layer. 8
Cleaning: Remove residual soldering flux to prevent corrosion. 7
Process Selection Suggestions
Protection requirements: In high-reliability scenarios (such as automotive electronics), polyurethane or silicone three-layer anti-corrosion paint (with a temperature resistance range of 150-200°C) should be preferred. 2
Welding requirements: The tin spraying process has low cost and excellent welding performance, but for high-precision boards, it needs to be combined with processes such as gold plating.
Combined, these features extend the component range down to the 03015mm microchip, yet preserve capability up to 120x90mm components up to 40mm tall and nearly 6” long (150mm) connectors.
1. Improved productivity.
With the high-speed XY manipulator and tape feeder, as well as the use of the newly developed "Fixed On-the-fly camera", the mounting capability of all components, from small components to large shaped components, can be improved.
In addition, with the new high-speed working head "H24 working head", the component mounting capacity of each module is up to 35,000CPH*, which is about 35% more than the NXT II.
2, corresponding to 03015 components, mounting accuracy ±25μm*
The NXT III not only corresponds to the smallest 0402 components used in production today, but also fits the next generation 03015 ultra-small components.
In addition, through the use of more rigid machine construction than existing models, independent servo control technology and component image recognition technology, can achieve the industry's best small chip mounting accuracy: ±25μm* (3σ) Cpk≧1.00
3, improve the operability
Inheriting the lang
Storage racks, protective covers, radiators,
Automatic width adjustment mechanisms.
380V 50HZ cleaning machine
largest offline cavity Cleaning machine
rotating spray cleaning machine
Smart support mes
PLC-controlled PCB cleaning machine
SMT PCB cleaner DI water
Factory direct PCB assembly
PLC controlled PCB cleaning
35L optimal liquid usage
Mirtec
Focus Distance
45mm
dimension
1080*1470*1560mmm(Length, width and height)
Field of view
54*50mm
power
1.1 KWkW
weight
About 950 kg
Power source
220V
illuminant
8 segments of coaxial lighting
noise
50 db
colour
white
Resolution
10/15 microns
Operating voltage
220V
Import or not
is
Processing customization
is
Effective pixel
15 million /25 million million
Country of origin
Import from Korea
Saleable land
The whole country
use
Test the SMT welding effect of PCBA with patch welding
Model number
MV-6e OMNI
High precision
simple operation
Specification
X-eye 6300NTI
Type
Hybrid Open Tube
Min.Focal spot
0.8um
X-rayTube
Max.Voltage
160kV
500uA
Max.Current
X-RAY
Resolution
9.6M Pixel FPD
Detector
K-erye 6300NT1
30FPS
Framerate
复
X,Y, R, T, Tube-Z
Axis
Stage
Stroke (x-Y-Z, mm)
460 × 510 x 200
ObliqueCT
Type
CT
3.5 sec/ FOv
Min. CT Scan time
×4~57
Geometric
Magnification
Digital
x4~1,000
Dimensions (W-D-H,)
1,480 × 2,270 x 2,060
System
4,200
Weight (kg)
Option
Cone-beam CT, 2D/2.5D Inspection
smartSMT LineSolutions
Cutting-edge Modular Mounter HM520
Increased actual production capacity and achieved excellent product
quality
The modular Head is applicable and can be flexibly combined with various production modes to form a
production line.
Through the Smart Factory S/W Solution, we aim to achieve unmanned operation, no downtime and no defective products in the production process.
含含
CE
0.89m
0.89m
0.89m
Specifications
X Y Z axle Cable transmission line Tank Protective Chain
Original FUJI NXT M3 M6 chain
Electronics production machinery
Machine type pick and place
220V voltage pick and place
1 year warranty pick and place