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The PCB spraying process mainly consists of two core processes: anti-corrosion paint coating and tin spraying, which are respectively used for protection and enhanced welding. The specific process involves key steps such as pre-treatment, spraying operation, curing, and post-treatment.
Three-anti-corrosion paint coating process flow
Preprocessing.
Cleaning: Use a dedicated cleaning agent or ultrasonic waves to remove oil, dust and ionic contamination from the PCB surface (standard requirement: ≤ 1.56 μg/cm²). 2
Baking the board: Preheat at 60℃ for 10-20 minutes to remove moisture and enhance the adhesion of the coating. 3 4
Shading: The non-coated areas (such as connectors) are protected using tape or a laser mask (with an accuracy of 50 μm). 2 4
Application implementation.
Method Selection:
Brush coating / Dip coating: Suitable for simple board shapes, but with low material utilization rate (dip coating loss reaches 40%). 2
Selective Spraying: Accuracy ± 0.1mm, suitable for components below 0402 or high-density boards. 2 5
Parameter Control: The spraying thickness is usually 25-75 μm. Be sure to avoid run-off or bubbles. 4 6
Solidification and Inspection.
Curing method: UV curing (dries within 3-5 seconds), thermal curing (gradually heated to 120℃), or moisture curing (humidity 40-60% RH). 2
Quality verification: Through X-ray thickness measurement (with an accuracy of ±1 μm) and salt spray test (no corrosion after 72 hours), etc. 2
Soldering process (HASL)
Preprocessing.
Micro-etching: Sodium peroxide solution corrodes the copper surface by 0.5 - 1 μm, enhancing the adhesion of the tin layer. 7 8
Soldering agent application: Uniform spraying to enhance the wetting property of the solder solution. 7
Soldering operation.
Immersion in tin: Immerse in tin solution at 265 ± 5℃ for 3 to 5 seconds (for lead-free process, it is a Sn96.5/Ag3/Cu0.5 alloy). 8
Hot air leveling: Using a high-pressure air knife at 280-300℃ to level the tin layer, with a thickness controlled at 1-3 μm. 8 9
Post-processing.
Cooling: Rapid cooling (> 4°C/second) is performed to stabilize the structure of the tin layer. 8
Cleaning: Remove residual soldering flux to prevent corrosion. 7
Process Selection Suggestions
Protection requirements: In high-reliability scenarios (such as automotive electronics), polyurethane or silicone three-layer anti-corrosion paint (with a temperature resistance range of 150-200°C) should be preferred. 2
Welding requirements: The tin spraying process has low cost and excellent welding performance, but for high-precision boards, it needs to be combined with processes such as gold plating.
Full inspection of solder paste printing quality
Smallest component
01005 (0.4×0.2mm)
Micro-sized components for mobile phone boards, wearable devices, etc.
Detection accuracy
X/Y: 10-25μm, Z-axis: ≤0.37μm
High-density boards, fine-pitch BGA
Detection speed
Approximately 22.5–91.2 cm²/s (depending on configuration)
High-speed production line, reducing production loss
Board bending compensation ±3mm ~ ±5mm
Model Y3
Performance Parametel Performance parametel
Conveyor Height 900±20mm
Deliverv Speed 2-5m/min
Delivery Directior L→R(R-L Optional
Dispense Valve Non-contactinjection valve Dispense valve Non-contactinjection valve
Valve pressure stabilization device Standard air pressure stabilizer Valve pressure stabilization device Standard air pressure stabilizer
Valve vacuum cleaninq device Valve vacuum cleaninq device Standard vacuum cleaning device
Valve nozzle heatinadevice Nozzleheating module Valve nozzle heatinadevice Nozzleheating module
Option OotionalLis
Needle dispensing valve, piezoelectric ceramic valve, screw valve, two-component glue valve, etc
Ceramic valve,screw valve,two-component valve,etc.
One-stage transport (two-stage transport, three-stage transport)
One-stage transportation(two-stage transportation, three-stage transportation)
Non-contactlaser height measurement System Non-contactlaser height measurement system
Weighing
The new NPM series mostly adopts the dual-track (Dual-Lane) design. When one track is for soldering, the other can simultaneously move the board up and down. The theoretical production capacity can reach up to 171,000 CPH, and the output rate per unit area is at the top of the industry.
Support for micro components and irregular parts
Supports from 01005 (metric 0402) micro chips to 150mm long connectors. By combining with a multi-functional head, it can easily handle irregular components such as BGA, QFN, and LED lamp boards, with extremely wide compatibility.
Automatic compensation for board warping (Z-Tracking)
For large-sized boards or flexible boards with warping problems, the equipment has a non-contact height sensor that can scan the PCB surface in real time and automatically adjust the soldering depth, effectively preventing short circuits. This is very important for automotive boards.
High- end Shelving Rack Plc And Motor Core Components