smt-nozzle

Panasonic NPM-D3 SMT Assembly line
Placement Speed: 84, 000 CPH
Accuracy：25 μm @ Chip
feeder specification : Max. 68
PCB size(mm):Max. L510*W590

FUJI NXTR A Model SMT Assembly line
Accuracy：±25 µm
Throughput*i：RH20 50,000 cph，RHO8 30,000 cph，RHO2 9.000 cph
PCB Size :370 x 610 mm, 370 x 280 mm
Applicable Part :0201mm to 5×5mm

3D AOI for Semiconductor Packaging
Extremely fast laser scan 2D & 3D AOI
Highly focused 2 channel laser for 3D data generation
3D laser can inspect highly specular surfaces (Bare die, IPD, Die Attach, and Underfill fillet)
High bandwidth on a broad range of colours, surface roughness, and materials

Panasonic NPM-D3A SMT Assembly line
Placement Speed: 46, 000 CPH
Accuracy：±37 μm @ Chip
feeder specification : Max. 68
PCB size(mm):Max. L510*W590

FUJI NXT IIIC SMT Assembly line
Accuracy：±25 µm
Speed: 35,000CPH
PCB size (LxW)：48 x 48 mm to 305 x 380 mm

YAMAHA YSP10 Solder paste printer
Applicable PCB：L510 x W510mm to L50 x W50mm (option : L650 x W510mm)
Printing accuracy：Positioning repeatability (6σ) : +/- 0.01mm
Applicable stencil size：L750 x W750mm, L736 x W736mm (29″)
Air supply source： 0.4MPa or more

GKG H2000 SMT Solder paste printer
Maximum substrate size：2000*510mm
Minimum substrate size：80*50mm
Substrate thickness dimensions：0.8~6mm
power requirement：AC:220 ± 10%, 50/60Hz 3KW

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