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Korea Kohyoung 3D SPI Fully Automatic Optical Solder Paste Detector Ky8030-3 Ky8030-2 Support Maximum Size 850*650 Mm Pcb
I. Equipment Positioning and Core Value
This equipment is the "gatekeeper" of high-yield SMT production lines. Its core value lies in eliminating measurement blind spots and improving pass rates:
Solving the shadow problem: Utilizing patented dual-light source (or four-directional projection) 3D measurement technology, it effectively resolves the shadow dead zones caused by the height difference of traditional SPI, ensuring the authenticity and reliability of measurement data.
Automatic compensation for board bending: With built-in real-time board bending detection and Z-axis compensation algorithm (Z-Tracking), even if the PCB has a ±3mm to 5mm warpage, it can automatically correct the data without the need for manual intervention.
Closed-loop control: Supports interaction with upstream printing machines and downstream AOI, feeding the inspection data back to the printing machine for automatic adjustment (such as scraper pressure, demolding speed), achieving process closed-loop optimization.
II. Key Performance Parameters
Parameter Item Performance indicators
Applicable scenarios
Detection type
True 3D (height, volume, area, shape)
Full inspection of solder paste printing quality
Smallest component
01005 (0.4×0.2mm)
Micro-sized components for mobile phone boards, wearable devices, etc.
Detection accuracy
X/Y: 10-25μm, Z-axis: ≤0.37μm
High-density boards, fine-pitch BGA
Detection speed
Approximately 22.5–91.2 cm²/s (depending on configuration)
High-speed production line, reducing production loss
Board bending compensation ±3mm ~ ±5mm
Soft board, large-sized board, automotive board
Maximum board size
Approximately 510mm × 460mm
Compatibility with conventional production lines
III. Defect detection range
KY8030-3 mainly targets volume and shape defects during the solder paste printing stage:
Insufficient solder / Excessive solder: Judged based on volume and height thresholds.
Bridge solder (bridging): Detects solder paste connections between adjacent pads.
Offset / Abnormal shape: Identifies printing position deviations and shape abnormalities such as protrusion, collapse, etc.
Flatness: Detects the coplanarity of the solder paste, providing a guarantee for subsequent BGA mounting.
IV. Market and selection recommendations
Applicable production lines: If your production line in factory mainly produces products with extremely high yield requirements such as mobile phones, communication modules, automotive electronics, etc., and has a high component density (01005, 0.3mm pitch BGA), this equipment is a standard configuration.
Second-hand market: This model is widely circulated in the market (commonly seen in 2015-2017 models). If considering second-hand equipment, it is necessary to carefully verify whether the Z-axis accuracy and board bending compensation function are normal.
Equipment weight: 800 kilograms
Power requirements: AC 220V 50Hz
Air source requirement: 5KGf/cm² (0.5Mpa)
Equipment Introduction: The KY-8030-2 has a speed increase of 3 times. It can recognize multi-panel barcodes and has an optimized process through 3D SPI + 3D AOI connection. It has the ability to automatically compensate for PCB board bending and can accurately measure the area of the printed solder paste to calculate the volume of the solder paste. High Yong has completely solved the shadow problem using dual light sources. More details can be found by clicking "More".
Equipment parameters
Equipment manual
List of accessories Parameters
Testing items
Volume, area, debugging, offset, bridging, shape, coplanarity
Types of defective items
Omission printing, excessive solder, insufficient solder, continuous solder, shape defect, offset, coplanarity
FOV/dimension
30×30mm (1.18×1.18 inch)
Full 3D detection speed
22.5 - 56.1 cm²/s
Minimum solder paste spacing
100μm (3.94 mils) Camera
4-megapixel camera
Lighting
IR-RGB LED (optional)
Z-axis resolution
0.37μm
Height accuracy (correction module)
1μm
Compatible with various color substrates
Can be 3.94 mils (5.91 mils solder paste height)
Track width adjustment
Automatic
Supported input formats
Gerber data (274X, 274D), ODB++ (optional)
Programming software ePM-SPI
Operational convenience
Generate a Library based on component dimensions to set inspection conditions Operating System
Windows 7 Ultimate 64 bit
Minimum pad spacing
100 μm (150 μm solder paste height)
| item | value |
| Weight (KG) | 800 |
| warranty | 1 Years |
| Machine Type | KY8030-2 |
| place of origin | South Korea |
| Voltage | 220V |
Shenzhen Yufuxin Technology Co., Ltd. is high-tech SMT assembly line Manufacturer, focusing on SMT assembly line equipment research and development,building new advanced solutions in SMT assembly line , LED Production line, semiconductor assembly line, energy machines assembly line and other areas.
1. who are we?
We are based in Guangdong, China, start from 2018,sell to Western Europe(00.00%),Africa(00.00%),Eastern Asia(20.00%),North America(20.00%),Southeast Asia(10.00%),Central America(10.00%),South Asia(10.00%),Eastern Europe(10.00%),Mid East(7.00%),Northern Europe(5.00%),Domestic Market(5.00%),South America(1.00%),Oceania(1.00%),Southern Europe(1.00%). There are total about 101-200 people in our office.
2. how can we guarantee quality?
Always a pre-production sample before mass production;
Always final Inspection before shipment;
3.what can you buy from us?
Samrt Chip Mounter Machine,3D AOI -SPI-AXI,Smart Insertion Mount Machine,N2 Reflow-Oven Machine,Smart Assemble Line
4. why should you buy from us not from other suppliers?
Shenzhen YFX Technology Co., Ltd. - Partner of SMT Solution Technologies was established in 2018. It is a global leading supplier of advanced surface mount technology equipment, components and integrated manufacturing solutions
Professional SMT/DIP/15year
5. what services can we provide?
Accepted Delivery Terms: FOB,CIF,EXW,DDP,Express Delivery;
Accepted Payment Currency: USD,HKD,CNY;
Accepted Payment Type: T/T,D/P D/A,Credit Card,PayPal,Cash;
Language Spoken: English
We are committed to producing the best quality products at the most competitive prices. Therefore, we sincerely invite all interested companies to contact us for more information.