KOREA HIGH END PEMTRON 3D AOI ATHENA 3D SPI SATURN

ATHENA Series
Technology and Features技术特性
Advanced High Speed Inspection and Measurement Technology先进的高速度检测和测量技术
Shadowfree Phase Measuring Profllometry无阴影高速检测和测圆技术
ATHENA Series 10Mp 8+4 projector 3D AOl inspect 100%of the PCB in 2D and 3D.Provide a complete opicalMoiré TechnologyOver 15 yoars of integraling phase moasuning profilomabry tochnology into our TROl solder pasle在Pamtron锡膏检测系统中已使用超过15年，相位轮席测量技术足以证明3D技术的先进性及有效性。●8+4 Projocion+Three stage 2D lighting
● 8+4投射+3层2D光源
■2D and 3D simultaneous inspection algorithms
2D和3D同步检测算法●Hgh speed GPU and Image processlng
●高配置GPU和图像处理
Userfilendly graphlcal Interface●简单明了的用户界面
●Ofine real time debug systam (option)
●离缘实时调试系统(选配)
High Speed Inspection Technology高速度检测技术inspecion of a PCB Shadow free and low false call maintaining a high flexiblilyin system functionally.inspection systems has proven the most advanced 3D tochnology available.● Telecentuic lens provde hlgher acouracy and deteclon
●远心镜头提供高精度的检测
● Buit n Ibrary management system
●标准元件库管理系统
ATHENA系列配备10Mp的相机和多角度投射对PCB进行100%的2D和3D全检。保障完全无阴影光学检测和任误报率，并保持高度灵活性的系统功能。
ATHENA high speed option inspect in 41cm²s by ufilzng an advanced network of more powerful GPU,controllerboards and our proprietary developed 10MP 15um 180fps camera with telecentic lens.采用独立自主的专业软件设计和高性能工控主机，拥有高效的运算能力及金面的硬件选配，进行最高效和稳定的测试。
High Component Inspection Technology高元件检则技术
ATHENA new 8+4 way oplion projechion technobogy provide 100%3D inspecion of 27mm and this is the frst in the yield.ATHENA选用全新的8+4方向的3D投射技术，可提供业界领先的27mm元件高度的全方位3D检查，选配ZAxis最高可以检查60mm器件。
27mm
Shadowfree 3D Technology无阴影3D技术
Eliminates shadow issues on highly populated PCBs and tall components.环状光源和多投射头能完全消除PCB测试时高密度阴影和高器件底音明影所产生的影响。
3D Solder &Height Measurement 3D焊锡高度测量
Using our advanced 3D technology,the ATHENA is able to take inspectionto levels that are limited by corvenionel 2D system.Adding sokder helght,vdume and part coplanarity nspecfion rovides enhanced defect detectioncapabilities.
利用我们先进的3D技术，ATHENA Sarieas能够检测到传统2D AOI无法到达的领城。坝加了焊锡高度、体积以及元件共面性的测试项目，大大提高了对不良产品的检测院力。
Optical Character Recognition光学字体核对
Recognzes component part characteers by using color and pattem algorithms.Ablity to add &modily OCR font to optimize inspection condition.
利用彩色抽色及建立样板比对的原理识别元件的Part Name能够增力晰修改OCR字体来优化Part Name的检测条件，更好的识别字体。

3D Automated Optical Inspection System
3D Lead Inspection 3D引脚检测
3D measurement algorithms enable the ATHENA to measure leadheight and volume of sokder proving full-high quality 3D images.
ATHENA Serlas检测原理：能够检测弓脚的焊锡高度和体积，并且提供高质量、真彩色3D图像。
2D RGB Algorithms 2D RGB算法
Through the RGB distinguish,operator can easily confim the failures,suchas cold joint and lift lead.
通过RGB颜色区分，使操作者更轻易的区分空焊、翘脚等不良。
Completely 3D Measurement Solution完美的3D测量方案
An accurate and convenient inspection by using side camera.使用侧面相机可更精准和便捷的测试
·4Way side camera (option)

·Possible to detec inside bridge which it cannot detect with top camera

● Possible to detect connector inside area

● Convenient teaching by using existing algorithm

● 4方向侧面相机《选配)

●可检测到只使用正面相机无法检测的引脚内部短路

●可检测到连接器内部区域

●使用已有的算法快捷教学

TDP
Ease of programming (Auto Teach Function)
编程简易(自动教学功能)
Advanced 3D imaging technology alows us to measureand recognze the geometric shapes of PCB componentsand automatically link them to our buit in parts library.
先进的3D图像处理技术能够精准识别和测量任何几何形状的元件并自动更新到标准元件库内。编程简单，调试快速。
Chip
Chip Array
SOT
SOP
QFP
0FN
Capacitor
x2
GuIIWing_3
Lead_14
Lead_Default
Lead_Default
JYY7TSOPLead_14
Real-Time Process Management Quality Management Solutions 实时监控和质量管控方案
Statistical Process Control 制程统计控制
● Pemtron's SPC module collects and analyses the inspection data,calculates
and displays the data at a glance.A robust SQL driven database lends theuser the flexiblity of sorting and exporting the desired production resultsin amuftitude of ways.
·The optional SPC Server colects data from multiple inspection systems over
SMT lines,all in one system and interface.
● Pemtron's SPC可收集和分析检验结果，并一目了然的显示给用户。灵活多变的SQL可以给
用户提供各种用户需要的报告、结果。
●服务番选项可樂中多台设备的在线监测结果、在SPC中实时反映产线的生产状况。

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