America Cyberoptics 3d Spi Smt Solder Paste Inspection Machine

CyberOptics SE500 SPI is a high-precision 3D solder paste detection system, which is widely used in SMT (Surface Mount Technology) production lines. It is mainly used to detect the printing quality of solder paste and ensure the reliability of the electronic assembly process. The following is the comprehensive information about this device:
 

Core technologies and parameters

Detection speed:
The detection speed of SE500 can reach 80 cm²/ second (@30µm accuracy) or 50 cm²/ second (@15µm accuracy), meeting the requirements of high-speed production lines while maintaining high precision.

Measurement accuracy:
Supports pad sizes as low as 01005 components (150µm × 150µm), providing 3D height, volume and area measurement, with a repeatability error (Gauge R&R) of less than 10% (6σ standard).

Panel size compatibility

SE500 standard model: Supports panel sizes ranging from 50× 50mm (2×2 inches) to 510×510 mm (20×20 inches).

Model SE500-X: Extended to 100×100 mm (4×4 inches) to 810×610 mm (32×24 inches), suitable for large circuit boards.

2. Technical advantages

High-precision 3D measurement
By adopting phase Profile measurement (PMP) and structured grating technology, combined with DLP (Digital Light Processing) projection modules, non-contact high-resolution detection is achieved, which is particularly suitable for small pads (such as 0201, 01005) and complex components (such as CSP, BGA).

Flexible warpage compensation
Equipped with a flexible circuit warpage compensation algorithm, it can handle the deformation of irregular pads and complex plates, enhancing the reliability of detection.

Multi-scenario adaptability
Supporting DL (double exposure) technology, it can stably detect on PCBS of different colors or reflective characteristics (such as white ceramic boards and black PCBS), solving the problem of detecting shadow areas.

3. Application Scenarios

Solder paste printing quality monitoring
Real-time detection of solder paste volume, thickness and distribution to prevent soldering defects (such as bridging and insufficient solder) caused by poor printing.

Process optimization and Closed-loop Feedback
Support linkage with printing machines, optimize printing parameters through a closed-loop feedback system, and reduce rework costs.

Data Analysis and Traceability
It is equipped with built-in SPC (Statistical Process Control) charts and user interface alarm functions, supports XML format data output, and is convenient for integration into the MES system.

4. Model and market situation

SE500 and SE500-X:
The SE500-X is an extended model, suitable for larger panels and higher production capacity demands. Both offer the Windows 7 operating system and the latest user interface.

Supply of second-hand equipment
Some markets (such as Europe) offer second-hand SE500-II models, equipped with the latest software and hardware maintenance, suitable for users with limited budgets.

5. Comparison of competing products

Industry status:
The CyberOptics SE500 series is renowned for its high speed and high precision, competing with brands such as Koh Young of South Korea and Omron of Japan, but with more competitive prices.

Technical differences:
Compared with the traditional laser scanning SPI, the surface structured light technology of SE500 performs better in the detection of complex boards and has lower maintenance costs.

Summary

With its high speed, high precision and flexible adaptability, CyberOptics SE500 SPI has become a key equipment for quality control in SMT production lines. Its technical advantages are particularly prominent in the detection of tiny components and the optimization of complex processes, making it suitable for electronic manufacturing enterprises that require high reliability