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YFX Machine: fabricante profesional de máquinas SMT que ofrece una solución integral.

Nancy@smt-yfx.com+86-13235536784

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KOREA SEC 3D XARY EYE S160F

No.

Equipment Name

Unit

Quantity

1

X-ray Inspection System with Computed Tomography Module

pcs.

1


1. PURPOSE

1.a. The technological equipment is intended for non-destructive testing of soldered joints of surface-mount components in various packages: BGA, QFN, QFP, SO, etc.; research of the internal structure of printed circuit boards and electronic components; support for work with low-density materials, including plastics, ceramics, optical elements, small cast parts made of titanium and aluminum; quality control of soldering for through-hole components; performing both standard X-ray (2D inspection) and computed tomography inspection; conducting 3D measurements and analysis.


2. MAIN TECHNICAL CHARACTERISTICS OF THE EQUIPMENT

2.a. Requirements established by the Buyer for the technical characteristics of the Equipment, requirements for functional characteristics (consumer properties), dimensions, and other indicators related to determining compliance of the supplied Equipment with the Buyer's needs are specified in Table 1.

2.b. Equipment Requirements – [to be filled by Supplier].

TABLE 1: Technical Parameters and Requirements

No.

Parameter Name

Condition

Unit

Value

1

Open-type microfocus X-ray tube

Exactly

Present

2

Maximum accelerating voltage of X-ray tube

Not less than

kV

160

3

Maximum current of X-ray tube

Not less than

µA

1000

4

Real-time display of acquired X-ray images

Exactly

Present

5

Minimum focal spot size

Not more than

µm

4

6

Maximum power of X-ray tube

Not less than

W

64

7

Maximum power on target

Not less than

W

10

8

Minimum distance from focal point to object

Not more than

µm

300

9

Minimum distance from focal point to detector

Not more than

mm

50

10

System resolution

Not more than

µm

0.95

11

Maximum angle of X-ray beam emission

Not less than

degrees

170

12

Minimum focusing

Not more than

µm

1

13

Overall dimensions of the installation (range): *length × width × height

From – to

mm

1400–1600 × 1550–1750 × 1900–2350

14

Maximum system weight

Not more than

kg

3200

15

Detector type – digital flat-panel

Exactly

Present

16

Pixel matrix resolution

Not less than

pixels

1536 × 1536

17

Active area size of detector

Not less than

mm

153 × 153

18

Maximum ADC bit depth of digital detector

Not less than

bits

16

19

Frame rate of images from digital detector

Not less than

fps

60

20

Detector pixel size

Not more than

µm

100

21

Detector dynamic range

Not less than

dB

64

22

Maximum number of frame accumulations

Not less than

pcs.

64

23

Detector dimensions (L × W × H)

Not more than

mm

187 × 183 × 53

24

Worktable size for sample placement (L × W)

Not less than

mm

630 × 630

25

Maximum weight of inspected sample

Not less than

kg

10

26

Maximum height of inspected sample

Not less than

mm

150

27

Minimum acquisition time (tomography)

Not more than

sec

20

28

Minimum reconstruction time

Not more than

sec

30

29

Maximum sample size

Not less than

mm

600 × 600

30

Maximum mass of inspected sample

Not less than

kg

10

31

Maximum height of inspected sample

Not less than

mm

150

32

Active inspection area of worktable (L × W)

Not less than

mm

500 × 500

33

Geometric magnification

Not less than

×

2000

34

Maximum detector tilt angle relative to sample

Not less than

degrees

65

35

Number of degrees of freedom during sample inspection

Not less than

6

36

Worktable travel range along X and Y axes

From – to

mm

0 – 500

37

Detector travel range along Z axis

From – to

mm

0 – 300

38

X-ray tube travel range along Z axis

From – to

mm

0 – 120

39

Digital detector rotation range relative to inspected sample

From – to

degrees

0 – 360

40

Minimum radiation dose rate at 100 mm from housing

Not more than

µSv/hour

1

41

Door-open sensors on service doors

Exactly

Present

42

Software module for 2D void detection

Exactly

Present

43

Resolution of built-in navigation camera

Not less than

pixels

4024 × 3036

44

Power consumption

Not more than

kW

4

45

Supply voltage

Exactly

V

220 ±10%

46

Built-in display diagonal size

Not less than

inches

27

47

Rotation option for CT (Planar type)

Exactly

Present

48

Basic CT functionality

Exactly

Present

49

Software module for automatic defect correction in 3D models

Exactly

Present

50

Computer workstation for CT reconstruction and analysis

Exactly

Present

51

Maximum PC hard drive capacity

Not less than

TB

1

52

PC RAM capacity

Not less than

GB

16

53

PC graphics card memory

Not less than

GB

8

54

Vibration isolation supports for vibration protection

Not less than

pcs.

4

55

Absence of wireless communication modules

Exactly

Present

56

Possibility of replacing cathode with filament

Exactly

Present

57

Possibility of replacing X-ray target (transmission target)

Exactly

Present

58

Built-in high-voltage generator

Exactly

Present

59

Capability to detect visually undetectable defects: voids, cracks, lack of wetting, missing leads inside component packages, insufficient solder fill in plated through-holes, layer misalignment in multilayer PCBs, short circuits and opens in inner layers, uneven metallization of vias; in cast parts: shrinkage cavities, voids, etc.

Exactly

Present

60

User authorization via built-in fingerprint scanner

Exactly

Present

61

Ability to save images in graphic formats: JPG, BMP, PNG, etc.

Exactly

Present

62

Capability to evaluate dimensions on images of inspected samples (distance, radius, curvature measurements, etc.)

Exactly

Present

63

Control panel with joystick and buttons for convenient positioning of sample, X-ray tube, and detector

Exactly

Present

64

Open-design X-ray tube with possibility of replacing cathode with filament

Exactly

Present

65

Possibility of replacing X-ray target

Exactly

Present

66

X-ray tube target must not contain toxic beryllium

Exactly

Present

67

Built-in high-voltage generator

Exactly

Present

68

Automatic electron beam focusing system based on electromagnetic lenses built into the tube

Exactly

Present

69

Independent software adjustment of current and voltage for X-ray intensity tuning

Exactly

Present

70

Control via software running on Windows 10 64-bit OS or GNU/Linux-based OS

Exactly

Present

71

Control via joystick, control panel buttons, keyboard and mouse; built-in monitor holder

Exactly

Present

72

Automatic target current and radiation intensity regulation system

Exactly

Present

73

Built-in digital dynamic flat-panel detector with amorphous silicon (a-Si TFT) pixel matrix

Exactly

Present

74

Worktable with carbon fiber insert for sample placement

Exactly

Present

75

Automatic centering function for inspected object on X-ray image during detector rotation and tilt

Exactly

Present

76

Built-in laser pointer for convenient sample positioning

Exactly

Present

77

Built-in navigation camera for convenient positioning of inspected sample relative to tube and detector

Exactly

Present

78

Two-stage integrated vacuum system for X-ray tube: turbomolecular pump with oil-free forevacuum pump

Exactly

Present

79

Built-in vacuum sensor in X-ray tube

Exactly

Present

80

USB port on control panel

Exactly

Present

81

Main power switch

Exactly

Present

82

Emergency stop button

Exactly

Present

83

Automatic motorized door controlled by button

Exactly

Present

84

Built-in transparent window in door

Exactly

Present

85

Built-in working area illumination

Exactly

Present

86

Built-in infrared sensors (light curtains) in sample loading window

Exactly

Present

87

Three-color signal light tower

Exactly

Present

88

Lead-shielded housing with personnel protection systems against X-ray radiation

Exactly

Present

89

Operation without connection of compressed air to the system

Exactly

Present

90

Module for cone-beam and planar tomography, including software

Exactly

Present

91

Reconstruction and analysis workstation for computed tomography

Exactly

Present

92

Additional computer for computed tomography

Exactly

Present

93

Specialized software for 3D visualization of tomographic scanning results

Exactly

Present

94

Function for automatic X-ray shutdown after 5 minutes of software inactivity

Exactly

Present

95

Automatic X-ray shutdown upon door opening

Exactly

Present

96

Software enabling:
• Analysis area mapping;
• Automatic void area calculation in solder joints;
• Image quality adjustment via graphic filters;
• Programming the system for automatic X-ray image acquisition;
• Creating custom filters and image processing algorithms;
• 3D image construction and analysis in CT mode;
• Geometric measurements;
• Adding marks and comments during analysis;
• Cone-beam computed tomography;
• Planar computed tomography;
• Automatic report generation;
• Programming the system for automatic X-ray image acquisition;
• Adding explanatory text inserts and pictograms to images;
• Control of X-ray tube electrical parameters

Exactly

Present

*Overall dimensions are determined by the workshop dimensions of PJSC "Signal" where the equipment will be installed.


2.c. Delivery Completeness Requirements

TABLE 2: Delivery Kit

No.

Delivery Item

Unit

Quantity

1

X-ray Inspection System with CT Module

pcs.

1

2

3D Tomography Module

pcs.

1

3

Worktable for sample placement and fixation

pcs.

1

4

Set of peripheral devices (PC, monitor, keyboard, mouse, monitor holder, control panel with joystick and buttons)

set

1

5

Digital detector

pcs.

1

6

X-ray tube

pcs.

1

7

Technical documentation

set

1

8

Equipment maintenance kit

pcs.

1

9

Power cable

pcs.

1

10

Radiation test report

pcs.

1

11

Operation manual

pcs.

1

12

Uninterruptible power supply (UPS) for computer

pcs.

1

2.d. Assemblies and components of each Equipment unit must be compatible and must not require additional modifications or equipment for operation as a standalone unit.


3. REQUIREMENTS FOR THE SUPPLIED EQUIPMENT

3.a. The supplied Equipment and its components must be new, not previously used (in operation, in storage), not repaired (including restoration or replacement of spare parts), not pledged, and not under arrest.

3.b. Supply of exhibition samples, as well as Equipment manufactured from used assemblies and components, is not permitted.

3.c. Equipment must be assembled under industrial conditions and be a serially produced model, as evidenced by the presence of the serial model in catalogs (supply of prototype or experimental samples is not permitted).

3.d. Equipment must be supplied complete and ensure structural and functional compatibility.

3.e. Technical, functional, and quality characteristics of the supplied Equipment must correspond to the characteristics specified in Section 2 of this Technical Specification.

3.f. Warranty period commences from the completion of installation, commissioning, adjustment, personnel training, and signing of: Act of Completed Installation Works, Act of Completed Commissioning Works, Act of Personnel Training, and Equipment Acceptance Certificate.

3.g. Warranty period during which the Buyer has the right to file claims upon discovery of defects, flaws, or other deficiencies of the Equipment shall be established by the Equipment manufacturer but shall be no less than 12 months.

3.h. During the warranty period, the Supplier must ensure warranty service with arrival of Supplier's specialists to the site within 2 (two) business days after receiving a request from the Buyer.

3.i. The Supplier bears all costs for eliminating defects and other deficiencies of the Equipment identified by the Buyer during the warranty period.

3.j. If the Equipment is under repair during the warranty period, the warranty term is extended by the duration of the repair.

3.k. The Supplier must provide warranty and post-warranty service support.

3.l. Warranty service includes replacement of failed electronic components, assemblies, or parts (hereinafter "Parts") with new Parts of the Equipment, as well as elimination of Equipment malfunctions not related to Part replacement. The Supplier undertakes to provide free Warranty service at the Buyer's location throughout the Warranty period and to eliminate malfunctions within five business days (provided the replacement part is available at the Supplier's warehouse). If part replacement requires shipment from the manufacturer to the Supplier, the elimination period may be extended to 30 calendar days from receipt of written or electronic notification from the Buyer describing the malfunction, or within a term additionally agreed by the Parties. The Supplier may refuse to perform Warranty service at its own expense if defects arose due to the Buyer's fault in cases listed in clause 3.13 of the Technical Specification.

3.m. Warranty service does not cover malfunctions arising due to the Buyer's fault in cases of:

  • Use of Equipment not for its intended purpose;
  • Any changes, upgrades, or modifications to the Equipment made without the Supplier's written consent;
  • Equipment damage caused by the Buyer;
  • Damage resulting from power supply failures;
  • Non-compliance by the Buyer with the preventive maintenance schedule and ignoring records of such works as prescribed in the Equipment operator's manual;
  • Making changes to the design or improper use of the Equipment without prior consent from the Supplier;
  • Warranty is valid only if the Equipment is operated at the original installation location. Warranty is void if the client relocates the Equipment without prior written consent from the Supplier.

3.n. In case of elimination of defects in Equipment under warranty, the warranty period is extended by the period during which the Equipment was not operated due to the discovered defects. Upon complete replacement of the Equipment, the warranty period restarts from the date of replacement.

3.o. Acceptance of Equipment by quantity is performed by the Buyer at the Buyer's warehouse in the presence of the Supplier's (Carrier's) representative who delivered the Equipment. In case of quantity mismatch, a Discrepancy Report (free form) is drawn up; signature of the Supplier's (Carrier's) representative is mandatory.

3.p. Acceptance of Equipment by completeness and quality is performed by the Buyer during commissioning and putting the Equipment into operation.

3.q. In case of discovery of latent defects, the Buyer unilaterally draws up a Latent Defects Report within 5 (five) business days from the moment of discovery, but within the established warranty period per this Agreement, and notifies the Supplier of the need to eliminate them or replace the Equipment.

3.r. The supplied Equipment must comply with all applicable requirements of TR CU 010/2011. Quality of the supplied Equipment must meet RF standards, CE norms, and must not threaten safety of life, health of the Buyer's employees, or environmental protection.

3.s. Service life, storage conditions, and operating conditions are determined by the manufacturer.

3.t. The Supplier bears all costs for eliminating defects and other deficiencies of the Equipment identified by the Buyer during the warranty period.

3.u. Assemblies and components of the Equipment must be compatible and must not require additional modifications or equipment for operation in working mode.


4. PRELIMINARY ACCEPTANCE

4.1. Preliminary acceptance of the Equipment is carried out at the manufacturer's plant or at the Supplier's warehouse (at the Buyer's discretion). At its own expense, the Supplier ensures preliminary acceptance for a minimum of 3 (three) Buyer's representatives, covering travel expenses from Stavropol to the Equipment manufacturer's location or Supplier's warehouse and back, as well as accommodation at the manufacturer's/Supplier's location.

4.2. During preliminary acceptance, the Buyer's representatives (no more than three) undergo introductory briefing, verify Equipment completeness per Table 2 of this Technical Specification, and verify main Equipment characteristics:

  • Maximum accelerating voltage of X-ray tube;
  • Maximum current of X-ray tube;
  • Maximum power of X-ray tube;
  • System resolution;
  • Pixel matrix resolution;
  • Frame rate from digital detector;
  • Detector field of view;
  • Real-time operation capability;
  • Scanning area;
  • Viewing angle range;
  • Maximum board size;
  • Maximum geometric magnification;
  • Operation of software modules specified in technical characteristics.

Acceptance is performed by analyzing test items for detection of voids in solder joints. Test items include:

  • Board with BGA-type microcircuit (3 pcs.);
  • Board with QFN-type microcircuit (3 pcs.);
  • Board with SNP-type connector (3 pcs.);
  • And/or other items at the Buyer's discretion.

Quality of X-ray images of detected defects must be no worse than examples shown in Figures 1–10 in Appendix 1. By agreement with the Buyer, other test items provided by the Supplier containing soldered electrical connections may be used.

Additionally, CT analysis of the internal structure of a BGA-type microcircuit is performed with construction of a 3D model of the solder bump area (500 × 500 µm) demonstrating the declared resolution capability of the Equipment. By agreement with the Buyer, other test items may be used.

During operation, the Supplier confirms safe X-ray radiation level – less than 1 µSv/h at any point 100 mm from the Equipment housing at maximum operating parameters – using a high-sensitivity radiometer or dosimeter registered in the State Register of Measuring Instruments and verified/certified in an accredited laboratory.

Preliminary acceptance and its organization (including insurance, visa, and other permit documentation) are carried out by the Supplier at its own expense. All works and expenses related to provision and transfer of test items to the Equipment manufacturer are borne by the Supplier.

4.3. The Supplier must notify the Buyer of the preliminary acceptance date no later than 10 (ten) calendar days from receipt of the request.

4.4. Failures, including malfunctions, during preliminary acceptance are not permitted.

4.5. Preliminary acceptance of the Equipment is documented by a bilateral Preliminary Acceptance Certificate (Appendix No. 10 to the Agreement).


5. REQUIREMENTS FOR PACKAGING, MARKING, AND SHIPMENT OF EQUIPMENT

5.1. The Supplier supplies the Equipment in packaging ensuring its complete preservation during transportation. Packaging cost is included in the Equipment price. Each Equipment item must contain marking, manufacturer's label, and manufacturer's trademark.

5.2. Equipment must be supplied in special packaging complying with standards, Technical Specifications, and mandatory rules/requirements for containers and packaging. Packaging must ensure complete preservation of the Equipment throughout its transportation, including transshipments and long-term storage.

5.3. Equipment must be shipped in packaging ensuring complete preservation from all types of damage and corrosion during transportation by any means of transport, considering multiple transshipments en route. Packaging must ensure Equipment preservation during transportation and unloading at the Buyer's premises.

5.4. If necessary, technological Equipment and its components must be equipped with devices for securing moving parts to exclude their movement during transportation.

5.5. Technological Equipment, as well as all assemblies and elements in transport packaging, must be stable. Unintentional tipping, falling, or displacement of the Equipment or its components in packaged form is not permitted.

5.6. For imported Equipment, upon Buyer's request, the Supplier provides documents (instructions and/or other information) related to the supplied Equipment, certified by signature and seal.

5.7. The Supplier must provide the Buyer with original accompanying documents for the Equipment, namely:

  • Invoice (if applicable);
  • Goods Delivery Note (TORGS-12 form) or Universal Transfer Document based on invoice form per FNS letter dated October 21, 2013 No. MMV-20-3/96@;
  • Act of Completed Installation Works; Act of Completed Commissioning Works; Act of Personnel Training; Equipment Acceptance Certificate;
  • Payment invoice.

5.8. Equipment shipment is carried out by the Supplier and/or with involvement of freight companies at the Supplier's expense to the Buyer's warehouse.

5.9. The Supplier undertakes to supply the Equipment with necessary technical documentation in electronic and paper format: a) Technical maintenance manual for the Equipment; b) Operation manual; c) Technical maintenance manual; d) List of fast-wearing spare parts; e) List of possible malfunctions and methods for their elimination.


6. EQUIPMENT SUPPLY PROCEDURE

6.1. Equipment supply is carried out by the Supplier to the Buyer's warehouse at the Supplier's expense on business days, with notification to the Buyer no later than 24 (twenty-four) hours before arrival of the Equipment at the address specified in clause 6.2.

6.2. Buyer's address: 355037, Stavropol Krai, Stavropol, 2nd Yugo-Zapadny Lane, Building 9A.

6.3. The Supplier arrives at the Buyer's location within 5 business days after Equipment delivery. Works specified in Section 7 of this Technical Specification must be completed within 3 business days.


7. REQUIREMENTS FOR ACCOMPANYING WORKS (SERVICES)

7.1. The Supplier performs the following works accompanying the Equipment supply:

7.1.1. Equipment Installation, including Commissioning Works, according to the following plan:

  • Inspection of packaging integrity for defects and internal damage;
  • Unpacking and verification of supplied Equipment completeness;
  • Visual inspection of Equipment;
  • Installation, assembly, and connection of main units and peripheral devices;
  • Connection of Equipment to power supplies;
  • Verification and adjustment of main Equipment units, as well as verification of peripheral devices operability.

7.1.2. Commissioning Works according to the following plan: Test items for works are provided by the Buyer. Test items include:

  • Board with BGA-type microcircuit (3 pcs.);
  • Board with QFN-type microcircuit (3 pcs.);
  • Board with SNP-type connector (3 pcs.);
  • And/or other items at the Buyer's discretion.

Quality of X-ray images of detected defects must be no worse than examples shown in Figures 1–10 in Appendix 1 to the Technical Specification. By agreement with the Buyer, other test items provided by the Supplier containing soldered electrical connections may be used.

Additionally, CT analysis of the internal structure of a BGA-type microcircuit is performed with construction of a 3D model of the solder bump area (500 × 500 µm) demonstrating the declared resolution capability of the Equipment. By agreement with the Buyer, other test items may be used.

During operation, the Supplier confirms safe X-ray radiation level – less than 1 µSv/h at any point 100 mm from the Equipment housing at maximum operating parameters – using a high-sensitivity radiometer or dosimeter registered in the State Register of Measuring Instruments and verified/certified in an accredited laboratory.

7.1.3. Personnel Training and Briefing on Equipment operation according to the following procedure:

Training and Briefing Program:

2D Operation Mode:

Basics of X-ray Defectoscopy:

  • Principles of X-ray generation;
  • Material absorption properties;
  • Digital detector. Duration: not less than 1 hour.

Safety Issues:

  • Operator safety techniques. Duration: not less than 0.5 hours.

X-ray Installation Device:

  • Device, main units and mechanisms;
  • Control panel;
  • Installation power on/off;
  • Initialization and warm-up of X-ray tube. Duration: not less than 1.5 hours.

Software:

  • Familiarization with program interface;
  • Working area, histogram, navigation panel;
  • Operating modes – snapshot, live image;
  • Selection of voltage and current depending on inspected object;
  • Methods for reducing detector noise;
  • Contrast adjustment;
  • Setting image scale (detector field of view);
  • Performing elementary evaluative measurements: by two/three points, CNC-assisted measurement;
  • Using filters;
  • Macros. Duration: not less than 8 hours.

Modules:

  • VC module;
  • Creating automatic programs. Duration: not less than 4 hours.

3D Operation Mode:

Basics of X-ray Computed Tomography:

  • Geometric magnification, voxel size;
  • Dependence of voxel size on power;
  • Number of projections during scanning;
  • Types of artifacts during reconstruction. Duration: not less than 1 hour.

Software:

  • Familiarization with program interface;
  • Volume registration in coordinate system;
  • Surface extraction / material separation;
  • Creation and export of polygonal model;
  • Measurement tools;
  • Analysis tools;
  • Optimization of volume file size. Duration: not less than 6 hours.

Technical Maintenance:

  • Frequency and stages of maintenance;
  • Control and adjustment of high-voltage cable, lubrication of cable tips;
  • Lubrication of ball screws and linear guides;
  • Target rotation and replacement;
  • Cathode replacement in X-ray tube. Duration: not less than 4 hours.

Total training duration: not less than 26 hours.

Group size for training: not less than 10 (ten) persons (6 technologists, 2 operators, 2 repair service specialists).

Briefing of personnel (2 repair service specialists) on technical maintenance and troubleshooting of the Equipment: not less than 4 hours.

Upon completion of training and briefing, an Act is drawn up per the form of Appendix No. __.

7.2. Works are performed in accordance with requirements of: [to be specified].


8. OTHER REQUIREMENTS

8.1. Equipment may be operated at ambient temperature from +5°C to +35°C and air humidity up to 70% at 20°C.

8.2. Equipment must be supplied fully complete for installation at PJSC "Signal" premises.


Deputy Chief Engineer – Chief Technologist
M. S. Khorunzhy
[Signature]


APPENDIX NO. 1

to the Technical Specification for Supply of X-ray Inspection System

Examples of Defects

Figure 1 – Voids under QFN-type microcircuit housing

Figure 2 – Voids in solder joint

Figure 3 – Voids in solder joint of BGA-type microcircuit

Figure 4 – Solder bridges in solder joints

Figure 5 – Solder flow-through in surface mount

Figure 6 – Contact pad of solder joint with BGA microcircuit and PCB

Figure 7 – TNT technology

Figure 8 – Three-ring effect

Figure 9 – HiP defect

Figure 10 – Micro-welding quality

Figure 11 – 3D model of solder bumps

Figure 11 – 3D model of solder bumps (duplicate)

 

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Teléfono: 0086-13235536784
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