YFX Machine - Professional SMT machine manufacturer providing one-stop solution.
|
No. |
Equipment Name |
Unit |
Quantity |
|
1 |
X-ray Inspection System with Computed Tomography Module |
pcs. |
1 |
1. PURPOSE
1.a. The technological equipment is intended for non-destructive testing of soldered joints of surface-mount components in various packages: BGA, QFN, QFP, SO, etc.; research of the internal structure of printed circuit boards and electronic components; support for work with low-density materials, including plastics, ceramics, optical elements, small cast parts made of titanium and aluminum; quality control of soldering for through-hole components; performing both standard X-ray (2D inspection) and computed tomography inspection; conducting 3D measurements and analysis.
2. MAIN TECHNICAL CHARACTERISTICS OF THE EQUIPMENT
2.a. Requirements established by the Buyer for the technical characteristics of the Equipment, requirements for functional characteristics (consumer properties), dimensions, and other indicators related to determining compliance of the supplied Equipment with the Buyer's needs are specified in Table 1.
2.b. Equipment Requirements – [to be filled by Supplier].
TABLE 1: Technical Parameters and Requirements
|
No. |
Parameter Name |
Condition |
Unit |
Value |
|
1 |
Open-type microfocus X-ray tube |
Exactly |
– |
Present |
|
2 |
Maximum accelerating voltage of X-ray tube |
Not less than |
kV |
160 |
|
3 |
Maximum current of X-ray tube |
Not less than |
µA |
1000 |
|
4 |
Real-time display of acquired X-ray images |
Exactly |
– |
Present |
|
5 |
Minimum focal spot size |
Not more than |
µm |
4 |
|
6 |
Maximum power of X-ray tube |
Not less than |
W |
64 |
|
7 |
Maximum power on target |
Not less than |
W |
10 |
|
8 |
Minimum distance from focal point to object |
Not more than |
µm |
300 |
|
9 |
Minimum distance from focal point to detector |
Not more than |
mm |
50 |
|
10 |
System resolution |
Not more than |
µm |
0.95 |
|
11 |
Maximum angle of X-ray beam emission |
Not less than |
degrees |
170 |
|
12 |
Minimum focusing |
Not more than |
µm |
1 |
|
13 |
Overall dimensions of the installation (range): *length × width × height |
From – to |
mm |
1400–1600 × 1550–1750 × 1900–2350 |
|
14 |
Maximum system weight |
Not more than |
kg |
3200 |
|
15 |
Detector type – digital flat-panel |
Exactly |
– |
Present |
|
16 |
Pixel matrix resolution |
Not less than |
pixels |
1536 × 1536 |
|
17 |
Active area size of detector |
Not less than |
mm |
153 × 153 |
|
18 |
Maximum ADC bit depth of digital detector |
Not less than |
bits |
16 |
|
19 |
Frame rate of images from digital detector |
Not less than |
fps |
60 |
|
20 |
Detector pixel size |
Not more than |
µm |
100 |
|
21 |
Detector dynamic range |
Not less than |
dB |
64 |
|
22 |
Maximum number of frame accumulations |
Not less than |
pcs. |
64 |
|
23 |
Detector dimensions (L × W × H) |
Not more than |
mm |
187 × 183 × 53 |
|
24 |
Worktable size for sample placement (L × W) |
Not less than |
mm |
630 × 630 |
|
25 |
Maximum weight of inspected sample |
Not less than |
kg |
10 |
|
26 |
Maximum height of inspected sample |
Not less than |
mm |
150 |
|
27 |
Minimum acquisition time (tomography) |
Not more than |
sec |
20 |
|
28 |
Minimum reconstruction time |
Not more than |
sec |
30 |
|
29 |
Maximum sample size |
Not less than |
mm |
600 × 600 |
|
30 |
Maximum mass of inspected sample |
Not less than |
kg |
10 |
|
31 |
Maximum height of inspected sample |
Not less than |
mm |
150 |
|
32 |
Active inspection area of worktable (L × W) |
Not less than |
mm |
500 × 500 |
|
33 |
Geometric magnification |
Not less than |
× |
2000 |
|
34 |
Maximum detector tilt angle relative to sample |
Not less than |
degrees |
65 |
|
35 |
Number of degrees of freedom during sample inspection |
Not less than |
– |
6 |
|
36 |
Worktable travel range along X and Y axes |
From – to |
mm |
0 – 500 |
|
37 |
Detector travel range along Z axis |
From – to |
mm |
0 – 300 |
|
38 |
X-ray tube travel range along Z axis |
From – to |
mm |
0 – 120 |
|
39 |
Digital detector rotation range relative to inspected sample |
From – to |
degrees |
0 – 360 |
|
40 |
Minimum radiation dose rate at 100 mm from housing |
Not more than |
µSv/hour |
1 |
|
41 |
Door-open sensors on service doors |
Exactly |
– |
Present |
|
42 |
Software module for 2D void detection |
Exactly |
– |
Present |
|
43 |
Resolution of built-in navigation camera |
Not less than |
pixels |
4024 × 3036 |
|
44 |
Power consumption |
Not more than |
kW |
4 |
|
45 |
Supply voltage |
Exactly |
V |
220 ±10% |
|
46 |
Built-in display diagonal size |
Not less than |
inches |
27 |
|
47 |
Rotation option for CT (Planar type) |
Exactly |
– |
Present |
|
48 |
Basic CT functionality |
Exactly |
– |
Present |
|
49 |
Software module for automatic defect correction in 3D models |
Exactly |
– |
Present |
|
50 |
Computer workstation for CT reconstruction and analysis |
Exactly |
– |
Present |
|
51 |
Maximum PC hard drive capacity |
Not less than |
TB |
1 |
|
52 |
PC RAM capacity |
Not less than |
GB |
16 |
|
53 |
PC graphics card memory |
Not less than |
GB |
8 |
|
54 |
Vibration isolation supports for vibration protection |
Not less than |
pcs. |
4 |
|
55 |
Absence of wireless communication modules |
Exactly |
– |
Present |
|
56 |
Possibility of replacing cathode with filament |
Exactly |
– |
Present |
|
57 |
Possibility of replacing X-ray target (transmission target) |
Exactly |
– |
Present |
|
58 |
Built-in high-voltage generator |
Exactly |
– |
Present |
|
59 |
Capability to detect visually undetectable defects: voids, cracks, lack of wetting, missing leads inside component packages, insufficient solder fill in plated through-holes, layer misalignment in multilayer PCBs, short circuits and opens in inner layers, uneven metallization of vias; in cast parts: shrinkage cavities, voids, etc. |
Exactly |
– |
Present |
|
60 |
User authorization via built-in fingerprint scanner |
Exactly |
– |
Present |
|
61 |
Ability to save images in graphic formats: JPG, BMP, PNG, etc. |
Exactly |
– |
Present |
|
62 |
Capability to evaluate dimensions on images of inspected samples (distance, radius, curvature measurements, etc.) |
Exactly |
– |
Present |
|
63 |
Control panel with joystick and buttons for convenient positioning of sample, X-ray tube, and detector |
Exactly |
– |
Present |
|
64 |
Open-design X-ray tube with possibility of replacing cathode with filament |
Exactly |
– |
Present |
|
65 |
Possibility of replacing X-ray target |
Exactly |
– |
Present |
|
66 |
X-ray tube target must not contain toxic beryllium |
Exactly |
– |
Present |
|
67 |
Built-in high-voltage generator |
Exactly |
– |
Present |
|
68 |
Automatic electron beam focusing system based on electromagnetic lenses built into the tube |
Exactly |
– |
Present |
|
69 |
Independent software adjustment of current and voltage for X-ray intensity tuning |
Exactly |
– |
Present |
|
70 |
Control via software running on Windows 10 64-bit OS or GNU/Linux-based OS |
Exactly |
– |
Present |
|
71 |
Control via joystick, control panel buttons, keyboard and mouse; built-in monitor holder |
Exactly |
– |
Present |
|
72 |
Automatic target current and radiation intensity regulation system |
Exactly |
– |
Present |
|
73 |
Built-in digital dynamic flat-panel detector with amorphous silicon (a-Si TFT) pixel matrix |
Exactly |
– |
Present |
|
74 |
Worktable with carbon fiber insert for sample placement |
Exactly |
– |
Present |
|
75 |
Automatic centering function for inspected object on X-ray image during detector rotation and tilt |
Exactly |
– |
Present |
|
76 |
Built-in laser pointer for convenient sample positioning |
Exactly |
– |
Present |
|
77 |
Built-in navigation camera for convenient positioning of inspected sample relative to tube and detector |
Exactly |
– |
Present |
|
78 |
Two-stage integrated vacuum system for X-ray tube: turbomolecular pump with oil-free forevacuum pump |
Exactly |
– |
Present |
|
79 |
Built-in vacuum sensor in X-ray tube |
Exactly |
– |
Present |
|
80 |
USB port on control panel |
Exactly |
– |
Present |
|
81 |
Main power switch |
Exactly |
– |
Present |
|
82 |
Emergency stop button |
Exactly |
– |
Present |
|
83 |
Automatic motorized door controlled by button |
Exactly |
– |
Present |
|
84 |
Built-in transparent window in door |
Exactly |
– |
Present |
|
85 |
Built-in working area illumination |
Exactly |
– |
Present |
|
86 |
Built-in infrared sensors (light curtains) in sample loading window |
Exactly |
– |
Present |
|
87 |
Three-color signal light tower |
Exactly |
– |
Present |
|
88 |
Lead-shielded housing with personnel protection systems against X-ray radiation |
Exactly |
– |
Present |
|
89 |
Operation without connection of compressed air to the system |
Exactly |
– |
Present |
|
90 |
Module for cone-beam and planar tomography, including software |
Exactly |
– |
Present |
|
91 |
Reconstruction and analysis workstation for computed tomography |
Exactly |
– |
Present |
|
92 |
Additional computer for computed tomography |
Exactly |
– |
Present |
|
93 |
Specialized software for 3D visualization of tomographic scanning results |
Exactly |
– |
Present |
|
94 |
Function for automatic X-ray shutdown after 5 minutes of software inactivity |
Exactly |
– |
Present |
|
95 |
Automatic X-ray shutdown upon door opening |
Exactly |
– |
Present |
|
96 |
Software enabling: |
Exactly |
– |
Present |
*Overall dimensions are determined by the workshop dimensions of PJSC "Signal" where the equipment will be installed.
2.c. Delivery Completeness Requirements
TABLE 2: Delivery Kit
|
No. |
Delivery Item |
Unit |
Quantity |
|
1 |
X-ray Inspection System with CT Module |
pcs. |
1 |
|
2 |
3D Tomography Module |
pcs. |
1 |
|
3 |
Worktable for sample placement and fixation |
pcs. |
1 |
|
4 |
Set of peripheral devices (PC, monitor, keyboard, mouse, monitor holder, control panel with joystick and buttons) |
set |
1 |
|
5 |
Digital detector |
pcs. |
1 |
|
6 |
X-ray tube |
pcs. |
1 |
|
7 |
Technical documentation |
set |
1 |
|
8 |
Equipment maintenance kit |
pcs. |
1 |
|
9 |
Power cable |
pcs. |
1 |
|
10 |
Radiation test report |
pcs. |
1 |
|
11 |
Operation manual |
pcs. |
1 |
|
12 |
Uninterruptible power supply (UPS) for computer |
pcs. |
1 |
2.d. Assemblies and components of each Equipment unit must be compatible and must not require additional modifications or equipment for operation as a standalone unit.
3. REQUIREMENTS FOR THE SUPPLIED EQUIPMENT
3.a. The supplied Equipment and its components must be new, not previously used (in operation, in storage), not repaired (including restoration or replacement of spare parts), not pledged, and not under arrest.
3.b. Supply of exhibition samples, as well as Equipment manufactured from used assemblies and components, is not permitted.
3.c. Equipment must be assembled under industrial conditions and be a serially produced model, as evidenced by the presence of the serial model in catalogs (supply of prototype or experimental samples is not permitted).
3.d. Equipment must be supplied complete and ensure structural and functional compatibility.
3.e. Technical, functional, and quality characteristics of the supplied Equipment must correspond to the characteristics specified in Section 2 of this Technical Specification.
3.f. Warranty period commences from the completion of installation, commissioning, adjustment, personnel training, and signing of: Act of Completed Installation Works, Act of Completed Commissioning Works, Act of Personnel Training, and Equipment Acceptance Certificate.
3.g. Warranty period during which the Buyer has the right to file claims upon discovery of defects, flaws, or other deficiencies of the Equipment shall be established by the Equipment manufacturer but shall be no less than 12 months.
3.h. During the warranty period, the Supplier must ensure warranty service with arrival of Supplier's specialists to the site within 2 (two) business days after receiving a request from the Buyer.
3.i. The Supplier bears all costs for eliminating defects and other deficiencies of the Equipment identified by the Buyer during the warranty period.
3.j. If the Equipment is under repair during the warranty period, the warranty term is extended by the duration of the repair.
3.k. The Supplier must provide warranty and post-warranty service support.
3.l. Warranty service includes replacement of failed electronic components, assemblies, or parts (hereinafter "Parts") with new Parts of the Equipment, as well as elimination of Equipment malfunctions not related to Part replacement. The Supplier undertakes to provide free Warranty service at the Buyer's location throughout the Warranty period and to eliminate malfunctions within five business days (provided the replacement part is available at the Supplier's warehouse). If part replacement requires shipment from the manufacturer to the Supplier, the elimination period may be extended to 30 calendar days from receipt of written or electronic notification from the Buyer describing the malfunction, or within a term additionally agreed by the Parties. The Supplier may refuse to perform Warranty service at its own expense if defects arose due to the Buyer's fault in cases listed in clause 3.13 of the Technical Specification.
3.m. Warranty service does not cover malfunctions arising due to the Buyer's fault in cases of:
3.n. In case of elimination of defects in Equipment under warranty, the warranty period is extended by the period during which the Equipment was not operated due to the discovered defects. Upon complete replacement of the Equipment, the warranty period restarts from the date of replacement.
3.o. Acceptance of Equipment by quantity is performed by the Buyer at the Buyer's warehouse in the presence of the Supplier's (Carrier's) representative who delivered the Equipment. In case of quantity mismatch, a Discrepancy Report (free form) is drawn up; signature of the Supplier's (Carrier's) representative is mandatory.
3.p. Acceptance of Equipment by completeness and quality is performed by the Buyer during commissioning and putting the Equipment into operation.
3.q. In case of discovery of latent defects, the Buyer unilaterally draws up a Latent Defects Report within 5 (five) business days from the moment of discovery, but within the established warranty period per this Agreement, and notifies the Supplier of the need to eliminate them or replace the Equipment.
3.r. The supplied Equipment must comply with all applicable requirements of TR CU 010/2011. Quality of the supplied Equipment must meet RF standards, CE norms, and must not threaten safety of life, health of the Buyer's employees, or environmental protection.
3.s. Service life, storage conditions, and operating conditions are determined by the manufacturer.
3.t. The Supplier bears all costs for eliminating defects and other deficiencies of the Equipment identified by the Buyer during the warranty period.
3.u. Assemblies and components of the Equipment must be compatible and must not require additional modifications or equipment for operation in working mode.
4. PRELIMINARY ACCEPTANCE
4.1. Preliminary acceptance of the Equipment is carried out at the manufacturer's plant or at the Supplier's warehouse (at the Buyer's discretion). At its own expense, the Supplier ensures preliminary acceptance for a minimum of 3 (three) Buyer's representatives, covering travel expenses from Stavropol to the Equipment manufacturer's location or Supplier's warehouse and back, as well as accommodation at the manufacturer's/Supplier's location.
4.2. During preliminary acceptance, the Buyer's representatives (no more than three) undergo introductory briefing, verify Equipment completeness per Table 2 of this Technical Specification, and verify main Equipment characteristics:
Acceptance is performed by analyzing test items for detection of voids in solder joints. Test items include:
Quality of X-ray images of detected defects must be no worse than examples shown in Figures 1–10 in Appendix 1. By agreement with the Buyer, other test items provided by the Supplier containing soldered electrical connections may be used.
Additionally, CT analysis of the internal structure of a BGA-type microcircuit is performed with construction of a 3D model of the solder bump area (500 × 500 µm) demonstrating the declared resolution capability of the Equipment. By agreement with the Buyer, other test items may be used.
During operation, the Supplier confirms safe X-ray radiation level – less than 1 µSv/h at any point 100 mm from the Equipment housing at maximum operating parameters – using a high-sensitivity radiometer or dosimeter registered in the State Register of Measuring Instruments and verified/certified in an accredited laboratory.
Preliminary acceptance and its organization (including insurance, visa, and other permit documentation) are carried out by the Supplier at its own expense. All works and expenses related to provision and transfer of test items to the Equipment manufacturer are borne by the Supplier.
4.3. The Supplier must notify the Buyer of the preliminary acceptance date no later than 10 (ten) calendar days from receipt of the request.
4.4. Failures, including malfunctions, during preliminary acceptance are not permitted.
4.5. Preliminary acceptance of the Equipment is documented by a bilateral Preliminary Acceptance Certificate (Appendix No. 10 to the Agreement).
5. REQUIREMENTS FOR PACKAGING, MARKING, AND SHIPMENT OF EQUIPMENT
5.1. The Supplier supplies the Equipment in packaging ensuring its complete preservation during transportation. Packaging cost is included in the Equipment price. Each Equipment item must contain marking, manufacturer's label, and manufacturer's trademark.
5.2. Equipment must be supplied in special packaging complying with standards, Technical Specifications, and mandatory rules/requirements for containers and packaging. Packaging must ensure complete preservation of the Equipment throughout its transportation, including transshipments and long-term storage.
5.3. Equipment must be shipped in packaging ensuring complete preservation from all types of damage and corrosion during transportation by any means of transport, considering multiple transshipments en route. Packaging must ensure Equipment preservation during transportation and unloading at the Buyer's premises.
5.4. If necessary, technological Equipment and its components must be equipped with devices for securing moving parts to exclude their movement during transportation.
5.5. Technological Equipment, as well as all assemblies and elements in transport packaging, must be stable. Unintentional tipping, falling, or displacement of the Equipment or its components in packaged form is not permitted.
5.6. For imported Equipment, upon Buyer's request, the Supplier provides documents (instructions and/or other information) related to the supplied Equipment, certified by signature and seal.
5.7. The Supplier must provide the Buyer with original accompanying documents for the Equipment, namely:
5.8. Equipment shipment is carried out by the Supplier and/or with involvement of freight companies at the Supplier's expense to the Buyer's warehouse.
5.9. The Supplier undertakes to supply the Equipment with necessary technical documentation in electronic and paper format: a) Technical maintenance manual for the Equipment; b) Operation manual; c) Technical maintenance manual; d) List of fast-wearing spare parts; e) List of possible malfunctions and methods for their elimination.
6. EQUIPMENT SUPPLY PROCEDURE
6.1. Equipment supply is carried out by the Supplier to the Buyer's warehouse at the Supplier's expense on business days, with notification to the Buyer no later than 24 (twenty-four) hours before arrival of the Equipment at the address specified in clause 6.2.
6.2. Buyer's address: 355037, Stavropol Krai, Stavropol, 2nd Yugo-Zapadny Lane, Building 9A.
6.3. The Supplier arrives at the Buyer's location within 5 business days after Equipment delivery. Works specified in Section 7 of this Technical Specification must be completed within 3 business days.
7. REQUIREMENTS FOR ACCOMPANYING WORKS (SERVICES)
7.1. The Supplier performs the following works accompanying the Equipment supply:
7.1.1. Equipment Installation, including Commissioning Works, according to the following plan:
7.1.2. Commissioning Works according to the following plan: Test items for works are provided by the Buyer. Test items include:
Quality of X-ray images of detected defects must be no worse than examples shown in Figures 1–10 in Appendix 1 to the Technical Specification. By agreement with the Buyer, other test items provided by the Supplier containing soldered electrical connections may be used.
Additionally, CT analysis of the internal structure of a BGA-type microcircuit is performed with construction of a 3D model of the solder bump area (500 × 500 µm) demonstrating the declared resolution capability of the Equipment. By agreement with the Buyer, other test items may be used.
During operation, the Supplier confirms safe X-ray radiation level – less than 1 µSv/h at any point 100 mm from the Equipment housing at maximum operating parameters – using a high-sensitivity radiometer or dosimeter registered in the State Register of Measuring Instruments and verified/certified in an accredited laboratory.
7.1.3. Personnel Training and Briefing on Equipment operation according to the following procedure:
Training and Briefing Program:
2D Operation Mode:
Basics of X-ray Defectoscopy:
Safety Issues:
X-ray Installation Device:
Software:
Modules:
3D Operation Mode:
Basics of X-ray Computed Tomography:
Software:
Technical Maintenance:
Total training duration: not less than 26 hours.
Group size for training: not less than 10 (ten) persons (6 technologists, 2 operators, 2 repair service specialists).
Briefing of personnel (2 repair service specialists) on technical maintenance and troubleshooting of the Equipment: not less than 4 hours.
Upon completion of training and briefing, an Act is drawn up per the form of Appendix No. __.
7.2. Works are performed in accordance with requirements of: [to be specified].
8. OTHER REQUIREMENTS
8.1. Equipment may be operated at ambient temperature from +5°C to +35°C and air humidity up to 70% at 20°C.
8.2. Equipment must be supplied fully complete for installation at PJSC "Signal" premises.
Deputy Chief Engineer – Chief Technologist
M. S. Khorunzhy
[Signature]
APPENDIX NO. 1
to the Technical Specification for Supply of X-ray Inspection System
Examples of Defects
|
Figure 1 – Voids under QFN-type microcircuit housing |
Figure 2 – Voids in solder joint |
|
Figure 3 – Voids in solder joint of BGA-type microcircuit |
Figure 4 – Solder bridges in solder joints |
|
Figure 5 – Solder flow-through in surface mount |
Figure 6 – Contact pad of solder joint with BGA microcircuit and PCB |
|
Figure 7 – TNT technology |
Figure 8 – Three-ring effect |
|
Figure 9 – HiP defect |
Figure 10 – Micro-welding quality |
|
Figure 11 – 3D model of solder bumps |
Figure 11 – 3D model of solder bumps (duplicate) |