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PANASONIC Chip Mounter Cm602 Smt Pick And Place Japanese Machine Smd Mounting Machine
Core Parameters
Soldering performance.
Speed: Standard model: 75,000 CPH (0.048 seconds per chip), High-speed model CM602-L: 100,000 CPH (0.036 seconds per chip). 2
Accuracy: ±40 μm (chip), ±35 μm (QFP ≥ 24mm), ±50 μm (QFP < 24mm), Cpk ≥ 1. 2 3
Component range: 0402 chips (minimum) to 100×90×25mm (maximum for multi-functional head support). 4
Mechanical configuration.
Soldering head: 12-nozzle high-speed head (standard) + 3-nozzle multi-functional head (with pressure control). 1 5
Shelf System: 7 types of universal shelves support 8-104mm tape packaging. An 8mm single shelf option is also available, with a maximum of 216 stations. 6
Substrate processing: Supports substrates ranging from 50×50mm to 510×460mm. Replacement time is 0.9 seconds (below 240mm). 3
Electrical and Dimensional
Power Supply: Three-phase AC 200-480V, 50/60Hz, 4kVA. 1 7
Pressure: 0.49 - 0.78 MPa, gas consumption 170 L/min. 6 7
Device dimensions: 2350 × 2690 × 1430 mm (Width × Depth × Height), weight 1680 kg (standard) / 3400 kg (CM602-L). 1 8
Technical Features
Modular Design: 10 combination options, compatible with CM402 hardware and software. 5 9
Magnetic levitation XY axis: Linear motor drive, combined with lightweight arm frame to enhance motion stability. 1 5
Operation Interface: Color LCD touch screen, supports language switching between Chinese, Japanese and English. 7
Applicable Scenarios
Mainly used in high-end manufacturing fields such as notebooks, mobile phones, and automotive electronics, it supports rapid model switching and high-level mixed production.
Multi chip mounter CM602 smt pick and place japanese machine smd mounting machine
Specifications
|
Model ID |
CM602-L |
|
PCB dimensions (mm) |
L 50 x W 50 to L 510 x W 460 |
|
High-speed head |
12 nozzles |
|
Max.speed |
100 000 cph (0.036 s/chip) |
|
Placement accuracy |
±40 µm/chip (Cpk1) |
|
Component dimensions (mm) |
(01005") 0402 chip *5 to L 12 mm × W 12 mm × T 6.5 mm |
|
High-flexibility head |
LS 8 nozzles |
|
Max.speed |
75 000 cph (0.048 s/chip) |
|
Placement accuracy |
±40 µm/chip, ±35 µm/QFP 24 mm, |
|
Component dimensions (mm) |
(01005”) 0402 chip *5 to L 32 mm × W 32 mm × T 8.5 mm *8 |
|
Multi-functional head |
3 nozzles |
|
Max.speed |
20 000 cph (0.18 s/QFP) |
|
Placement accuracy |
±35 µm/QFP (Cpk1) |
|
PCB exchange time |
0.9 s (Board length:up to 240 mm Under optimum conditions) |
|
Electric source |
3-phase AC 200, 220, 380, 400, 420, 480 V, 4.0 kVA |
|
Pneumatic source *1 |
0.49 MPa, 170 L /min(A.N.R.) |
|
Dimensions (mm) |
W 2 350 x D 2 290 *2 x H 1 430 *3 |
|
Mass *4 |
3 400 kg |
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