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Panasoniic Npm-gp/l Printing Machine
A skill-free Autonomous Factory with edge devices, automation functions and 5M process control.
5M Process control
Monitor material and equipment status and automatically change equipment parameters
In conjunction with the inspection machine, the M2M function is used to optimize the printing position and volume
Support for automation
Automation of model switching operations
Automation of operations in production
Improve basic performance
Printing cycle time: 12 s, repeated positioning accuracy: ± 3.8μm
Support high precision and high density printing
Characteristics and effects of "Solder paste printing machine NPM-GP/L"
The APC-5M enables monitoring and control of material and equipment status
APC-5M
Solder paste viscosity feedback (standard option)
Solder paste viscosity feedback (standard option)
Measure and control the solder paste viscosity on the screen to maintain proper viscosity.
Grid tension feedback (standard option)
Grid tension feedback (standard option)
Measure the tension of the plate before printing and change the action of the plate.
Cleaning solvent throughput feedback (standard option)
Cleaning solvent throughput feedback (standard option)
During wet cleaning, monitor the amount of solvent spit out to keep the amount of spit out appropriate.
In conjunction with the inspection machine, the M2M function is used to optimize the printing position and volume
According to the results of SPI, the optimal printing state is achieved and maintained by changing the conditions of printing pressure, scraper speed and off-grid speed.
Achieve and maintain optimal printing condition
Based on the results of SPI, the printing position and volume are automatically corrected. There are two options for position correction and volume correction.
The APC-FB (volume) controls the volume by changing the Angle of the scraper, so the best printing condition can be achieved and maintained smoothly.
APC-FB (Location) (standard option)
APC-FB (Location) (standard option)
APC-FB (Volume) (standard option) *
APC-FB (Volume) (standard option)
※ Need variable Angle scraper (standard option).
Expanded automation and personalization
Automation of model switching
Solder paste transfer (standard option)
Solder paste transfer (standard option)
Automatic recovery of solder paste on the screen after printing. Automatically supply solder paste to the next model with mesh board.
Board changer (standard option)
Board changer (standard option)
After the end of production, the network board is automatically stored in the network board library behind the equipment, and the network board used by the next model is installed to the equipment. The net board library can store up to 10 pieces, and the production can also be taken out and put into the net board.
Support pin automatic replacement (standard option)
Support pin automatic replacement (standard option)
It can be saved through model switching and automatic recovery and configuration of support pins.
Automation of operations in production
Automatic tin feed with open bottle (standard option)
Automatic tin feed with open bottle (standard option)
By automating the tin supply, it is possible to achieve economization and continuous operation.
Paperless wiping unit (standard option)
Paperless wiping unit (standard option)
The cleaning function does not use cleaning paper and solvents. Can cut the wiping paper and solvent.
Solder paste leak block (standard option)
Solder paste leak block (standard option)
Through the reaction force of the magnet to contact with the screen board, inhibit the solder paste horizontal leakage during printing. And the structure is simple, easy to clean.
Supports high precision and high density printing
Variable Angle of attack scraper (standard option)
Variable Angle of attack scraper (standard option)
The Angle of the scraper can be adjusted by the upper and lower axes of the front and back scrapers, and the setting can be performed in the range of 45° ~ 70°.
Top/side clamps (movable) (standard option)
Top/side clamps (movable)
(Standard option)
The printing quality of the curved substrate is improved by pressing the end face of the substrate from above.
You can choose to correct it from above or from the side of the substrate.
Solder paste printer NPM-GP/L
Solder paste printer NPM-GP/L
A skill-free Autonomous Factory with edge devices, automation functions and 5M process control.
5M Process control
Monitor material and equipment status and automatically change equipment parameters
In conjunction with the inspection machine, the M2M function is used to optimize the printing position and volume
Support for automation
Automation of model switching operations
Automation of operations in production
Improve basic performance
Printing cycle time: 12 s, repeated positioning accuracy: ± 3.8μm
Support high precision and high density printing
Download the "Solder Paste Press NPM-GP/L" catalog
A registered member is required to download the material.
After registration, you can browse all the information on our website.
Apply for "NPM-GP/L" specification
Customers who are already using Panasonic electronic components, semiconductors, and FPD can easily search through P-Web.
View NPM-GP/L in full screen
Characteristics and effects of "Solder paste printing machine NPM-GP/L"
The APC-5M enables monitoring and control of material and equipment status
APC-5M
Solder paste viscosity feedback (standard option)
Solder paste viscosity feedback (standard option)
Measure and control the solder paste viscosity on the screen to maintain proper viscosity.
Grid tension feedback (standard option)
Grid tension feedback (standard option)
Measure the tension of the plate before printing and change the action of the plate.
Cleaning solvent throughput feedback (standard option)
Cleaning solvent throughput feedback (standard option)
During wet cleaning, monitor the amount of solvent spit out to keep the amount of spit out appropriate.
In conjunction with the inspection machine, the M2M function is used to optimize the printing position and volume
According to the results of SPI, the optimal printing state is achieved and maintained by changing the conditions of printing pressure, scraper speed and off-grid speed
We are committed to producing the best quality products at the most competitive prices. Therefore, we sincerely invite all interested companies to contact us for more information.