YFX Machine - Professional SMT machine manufacturer providing one-stop solution.
SMT equipment utilized in the electronics manufacturing industry for mounting electronic components directly onto the surface of printed circuit boards (PCBs), as opposed to traditional through-hole technology. This process involves several key steps and corresponding equipment:
• Pick and Place Machines: These highly accurate robots pick up tiny components from feeders and precisely place them onto the PCB, following a predefined program derived from the circuit design.
• Reflow Ovens: After component placement, PCBs are passed through reflow ovens where controlled heat melts solder paste, creating strong electrical connections between components and the board.
• SMT Stencil Printer: Prior to component placement, solder paste or adhesive is evenly deposited onto the board using a steel or polymer mesh screen, ensuring precise application.
• Inspection Systems: AOI and X-ray Inspection systems meticulously scan PCBs for defects, such as missing, misplaced, or incorrectly oriented components, as well as soldering issues.
YFX Machine as one of the SMT equipment manufacturers, provides a range of smt manufacturing equipment, welcome to contact us.
Solder paste for 100% high precision 3D measurement.
◆ The application of programmable structure grating (PSLM) has changed the traditional Moire glass driven by ceramic piezoelectric motor (PZT)
Glass grating form. The mechanical drive and transmission part are cancelled, which greatly improves the ease of use and avoids mechanical wear and maintenance
Cost of repair.
◆ High precision and ultra-high frame number of 4 megapixel industrial camera, with precision screw and guide rail, to achieve high-speed and stable detection.
The patented DL combined with the easily adjustable RGB light source perfectly solves the shadow effect interference in 3D measurement.
◆Gerber data conversion and import, realize automatic detection of the whole board. The manual Teach function is convenient for users when there is no Gerber data
Prog
● Online conveying system: rail conveying method, conveying direction (left → right, or right → left) is optional.
● Flux selective spray mode, spray path is controlled by program; Adjustable spray pressure and flow rate; With automatic rosin adding system; Equipped with exhaust system, flux collection system.
● Preheating system: hot air heating method, hot air temperature, wind pressure, preheating time can be adjusted.
● Welding system: selective welding mode, tin furnace relative to PCB move, according to the program set welding path and welding time; Wave peak height and tin furnace temperature can be adjusted; Lightweight tin furnace, equipped with tin furnace liquid level detection tin line automatic adding device.
● Nitrogen system (option) : Nitrogen system, nitrogen consumption is about 5 cubic meters/hour. Save heating time and flux amount, reduce virtual welding, cavity rate
● Control mode: PLC+ touch screen control.
Se
V12
H12HS
H08M
H02
H01
OF
Number of mouthpieces
twelve
8
2
one
one
(or mechanical claw 1)
Production Capacity (cph)
26000
22500
13000
5500
4200
3000
Dimension of the image element
(mm)
0402 ~ 7.5×7.5
Height: Maximum 3.0mm
0603 ~ 45×45
Height: Maximum 13.0mm
1608 ~ 74×74
(32×180)
Height: Maximum 25.4mm
1608 ~ 74×74
(32×180)
Height: Maximum 38.1mm
Component has confirmation function
a.
H12HSQ
(H08MQ)
a.
x
mods
package
Charge zone
a.
a.
a.
a.
Stock pipe
x
a.
a.
a.
Charging tray
x
a.
a.
a.
Basic specification
Frame board size (L × W)
48mm x 48mm ~ 774mm x 318mm (double handling track specifications/double handling)
48mm×48mm ~ 774mm×586mm (double handling track specifications/unit handling)
48mm×48mm ~ 774mm×686mm (Unit handling track specifications)
Type of component
MAX 130 type (converted to 8mm material band)
Board loading time
Double handling track: 0sec for double handling, 5sec for 5sec for single han