I . T . T Technology - Professional SMT Equipment Retail and Wholesale ,Manufacturer Providing One - Stop Solution.
Sales01@smt-yfx.com Whats | Wechat App ： 86 133 1693 5262
SMT equipment utilized in the electronics manufacturing industry for mounting electronic components directly onto the surface of printed circuit boards (PCBs), as opposed to traditional through-hole technology. This process involves several key steps and corresponding equipment:
• Pick and Place Machines: These highly accurate robots pick up tiny components from feeders and precisely place them onto the PCB, following a predefined program derived from the circuit design.
• Reflow Ovens: After component placement, PCBs are passed through reflow ovens where controlled heat melts solder paste, creating strong electrical connections between components and the board.
• SMT Stencil Printer: Prior to component placement, solder paste or adhesive is evenly deposited onto the board using a steel or polymer mesh screen, ensuring precise application.
• Inspection Systems: AOI and X-ray Inspection systems meticulously scan PCBs for defects, such as missing, misplaced, or incorrectly oriented components, as well as soldering issues.
YFX Machine as one of the SMT equipment manufacturers, provides a range of smt manufacturing equipment, welcome to contact us.
Circuits to be inspected: Circuit boards before and after the SMT reflow oven - Zhongguo Vision Test Boardc flow and after-reflow PCB ins|
Detection method: 3D shape deep learning, TOC, Match, Short, IC, OCR Test Metho 3D shapein deeUeaocineH
Fast / Flexible Mounter DECAN
888 New Generation Medium-Speed Surface Mount DECNs1 。 Improve actual production efficiency
. Enhance assembly quality
. Reduce reject rate
This equipment was developed to significantly enhance the three key indicators of the soldering machine. It provides the optimal production efficiency required for multi-variety production. Specifications
Model Name DECNS1
Alignment Fly Camera + Fix Camera
The number of spindles 10 spindles x 1 Gantry
Placement Speed: 47,000 CPH (Optimal)
Placement Chip: +28μm @ Cpk > 1.0
Accuracy of IC: ±35μm @ Cpkz 1.0
Fly Camera: 03015 - 16mm Component ~D42mm(Standard
Range Fix Camera: 42mm - 55mm (MFOV) L55mm~L75mmConnector (MFOV
Max.Height 10mm(Fly),15mm(Fix)
Min 50(L)x40(W)
PCB Size Standard 510(L)x510(W)
(mm) Max
Option ~ Maximum 1,500 (L) x 460 (W)
PCB Thickness (mm) 0.38 - 4.2 Feeder Capacity Standard 60ea/ 56ea(Fixed feederbase/ Docking Cart)
(8mm standard) Option 120ea/112ea (Fixed