TR7500 SII Main Technical Specifications
Inspection Capability
Inspection Technology: Hybrid 2D + 3D inspection technology
3D Measurement: True 3D profile measurement using dual laser units
Minimum Component Inspection: Capable of detecting as small as 01005 ultra-miniature components
Inspection Targets: Component fine details, solder joints, and entire PCB surface
Imaging System
Camera: High-speed color multi-angle camera (multi-angle imaging)
Lighting: Multi-angle color lighting system
Application Areas
Automated optical inspection of PCBs in SMT assembly lines
Solder joint quality inspection, component placement verification, polarity, missing or incorrect part detection, etc.