PARMI Online 3D AOI Xceed - New Generation Performance Description:

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1:3D AOI Laser Head (TRSC-I)

1-1. Dual laser light source projection technology, high resolution CMOS lens with 4 million pixels.

1-2.RGBW LED light source.

1-3. Telecentric lens.

1-4. Ultra-lightweight laser, compact design.

1-5. High detection speed in the industry: 65cm2/ sec@14 x 14umm.

1-6. Detection time (including the time of entering and leaving the board) : The detection time based on PCB 260mm(L) X 200mm(W) is 10 seconds.

3D-AOI- Laser head.jpg





2: PARMI online 3D AOI

The 3-dimensional test data can ensure the degree of detection and overcome false defects.

PARMI online 3D-AOI inspection effect.jpg



3: The whole test is not affected by PCB material, surface and color

Different PCB material detection effect.jpg



4: Real 3D Image

The signal processing technology shows a true and clear 3D image without any noise.

3D test effect.jpg



PARMI online

PARMI SPI
Product name: Online 3D SPI

Product model: SigmaX

Machine brand: PARMI

Machine origin: South Korea

Product category: SMT equipment

Model: NDT-X3500 (A, B, C)
NDT3500A--100KV light tube
NDT3500B--130KV light tube
Size: 1160*1090*1857 mm
Weight: 1100KG
Power supply: single-phase 110~230V/50~60Hz
Optical tube type: Closed
Focal Spot: 5 um
Panoramic range: plus or minus 60 degree tilt
X-ray output voltage: 90~130 KV
Magnification: 120 (geometry) /1200 (system)
Camera lens specifications: Image intensifier + digital CCD 25 frames/m
CCD pixels: 1.3 million
System image resolution: 110 LP/CM (light pair per cm)
Image area: 600 x 415 mm
Performance: Leakage

Measuring range
3072*3072pixels
Resolution
1500 * 1500
unfold
This equipment is mainly used for the SMT industry production of Reel materials for quick counting, with a high degree of industry 4.0 as the standard, intelligent modular design, 7-17 inch Tape Reel/JEDEC Tray/IC tide sensitive bag and other whole items of materials, equipped with artificial intelligence deep learning software, cloud update system.
Material types include all resistance-capacitance materials and IC materials. X-ray imaging technology is used to detect production materials and obtain image information. The actual quantity of materials can be obtained by fast counting through the image algorithm independently developed by SEAMARK Company. Meanwhile, the number of materials can be classified and counted according to categories, and the equipment data information can be connected with the customer's MES system.
X-RAY point machine measurement results

Sequence category Pan Size Quantity accuracy cycle time
1 010

TR7500 SII Main Technical Specifications

Inspection Capability
Inspection Technology: Hybrid 2D + 3D inspection technology
3D Measurement: True 3D profile measurement using dual laser units
Minimum Component Inspection: Capable of detecting as small as 01005 ultra-miniature components
Inspection Targets: Component fine details, solder joints, and entire PCB surface

Imaging System
Camera: High-speed color multi-angle camera (multi-angle imaging)
Lighting: Multi-angle color lighting system

Application Areas
Automated optical inspection of PCBs in SMT assembly lines
Solder joint quality inspection, component placement verification, polarity, missing or incorrect part detection, etc.

Functional Specifications: ALD8710S, ALD8710D, ALD8730S, ALD8730D
Circuits to be inspected: Circuit boards before and after the SMT reflow oven - Zhongguo Vision Test Boardc flow and after-reflow PCB ins|
Detection method: 3D shape deep learning, TOC, Match, Short, IC, OCR Test Metho 3D shapein deeUeaocineH

3d X-ray Ct Inspection System High Precision Non Destructive Testing Equipment For Smt Production