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Tri's Smart 7700 SIII 3D AOI PCB Inspector with PLC, 380V/220V made in taiwan
Product Introduction
Introduction to the Delu TR7700SIII3D: pioneering 3D AOI solution adopts an ultra-fast hybrid PCB inspection method, integrating optical and blue laser 3D real-profile measurement. This enables maximum coverage for automated detection of defective phenomena. Combined with the most advanced software solutions and the third-generation intelligent hardware platform, it provides stable and powerful 3D solder joint and component defect detection, featuring high detection coverage and the advantage of simple programming.
Features of the Delu TR7700SIII3D:
High-speed 2D + 3D inspection, capable of detecting components down to 01005 size.
2. High defect coverage, employing a hybrid 2D + 3D detection technology
3. True 3D contour measurement technology, using two laser units
4. An intelligent rapid programming interface with automated database and offline programming capabilities
DELU TR7700S III 3D Specifications:
Optical System
Imaging Method Dynamic Imaging with true 3D profile measurement
Top Camera 4 Mpix
Angle Camera N/A
Imaging Resolution 10 µm, 15 µm (factory setting)
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors
Max. 3D Range 20 mm
Inspection Performance
Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*
* Depending on board size and laser resolution
Motion Table & Control
X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm
Board Handling
Max PCB Size TR7700 SIII 3D: 510 x 460 mm
TR7700L SIII 3D: 660 x 460 mm
TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane
PCB Thickness: 0.6 - 5 mm Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm [5 mm optional]
Conveyor Inline
Height: 880 – 920 mm
* SMEMA Compatible
Inspection Functions
Component Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component
Solder Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
Dimensions
WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm
TR7700L SIII 3D: 1300 x 1650 x 1650 mm
TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
Weight TR7700 SIII 3D: 1030 kg
TR7700L SIII 3D: 1250 kg
TR7700 SIII 3D DL: 1150 kg
Product Introduction
Introduction to the Delu TR7700SIII3D: pioneering 3D AOI solution adopts an ultra-fast hybrid PCB inspection method, integrating optical and blue laser 3D real-profile measurement. This enables maximum coverage for automated detection of defective phenomena. Combined with the most advanced software solutions and the third-generation intelligent hardware platform, it provides stable and powerful 3D solder joint and component defect detection, featuring high detection coverage and the advantage of simple programming.
Features of the Delu TR7700SIII3D:
High-speed 2D + 3D inspection, capable of detecting components down to 01005 size.
2. High defect coverage, employing a hybrid 2D + 3D detection technology
3. True 3D contour measurement technology, using two laser units
4. An intelligent rapid programming interface with automated database and offline programming capabilities
DELU TR7700S III 3D Specifications:
Optical System
Imaging Method Dynamic Imaging with true 3D profile measurement
Top Camera 4 Mpix
Angle Camera N/A
Imaging Resolution 10 µm, 15 µm (factory setting)
Lighting Multi-phase RGB+W LED
3D Technology Single/Dual 3D laser sensors
Max. 3D Range 20 mm
Inspection Performance
Imaging Speed 4 Mpix@ 10 µm 2D: 60 cm²/sec
4 Mpix@ 15 µm 2D: 120 cm²/sec
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec*
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec*
* Depending on board size and laser resolution
Motion Table & Control
X-Axis Control Ballscrew + AC-servo controller
Y-Axis Control Ballscrew + AC-servo controller
Z-Axis Control N/A
X-Y Axis Resolution 1 µm
Board Handling
Max PCB Size TR7700 SIII 3D: 510 x 460 mm
TR7700L SIII 3D: 660 x 460 mm
TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane
PCB Thickness: 0.6 - 5 mm Max PCB Weight 3 kg
Top Clearance 25 mm
Bottom Clearance 40 mm
Edge Clearance 3 mm [5 mm optional]
Conveyor Inline
Height: 880 – 920 mm
* SMEMA Compatible
Inspection Functions
Component Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
Lifted Component
Solder Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
Dimensions
WxDxH TR7700 SIII 3D: 1100 x 1670 x 1550 mm
TR7700L SIII 3D: 1300 x 1650 x 1650 mm
TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm
Note: not including signal tower, signal tower height 520 mm
Weight TR7700 SIII 3D: 1030 kg
TR7700L SIII 3D: 1250 kg
TR7700 SIII 3D DL: 1150 kg
We are committed to producing the best quality products at the most competitive prices. Therefore, we sincerely invite all interested companies to contact us for more information.