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The MS-11 series uses 3D to check printing 1

The MS-11 series uses 3D to check printing 2

The MS-11 series uses 3D to check printing 3

The MS-11 series uses 3D to check printing

The MS-11 series uses 3D to check printing The status of solder paste,accurate analysis of adverse phenomena and causes in the production to help improve production quality. process,Moreover, an affordable 3D SPI that can detect 0201mm solder pads is installed with 25 megapixel main phaser.

Two sets of molar light emitters
2500/1500/4 megapixel main camera
CoaXPress High Performance Transmission System
Bending does not affect testing
Integrated Quality Management System

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Product Description

The MS-11 series uses 3D to check printing 4

Dual molar light emitter

Test using a single molar light that tends to produce shadows, Using double molar light can eliminate the shadow produced by single molar light test and achieve precise and accurate 3D test effect

The MS-11 series uses 3D to check printing 5

Using dual molar light to completely solve shadow problems

Combined use can test the complete amount of solder paste Perfect and precise 3D measurement function

The MS-11 series uses 3D to check printing 6

The world's first ultra high resolution 25 megapixel main camera

The world's only 25-megapixel high resolution mainCamera allows accurate and stable detection, uses the CoaXPress ultra-high performance vision system, transmits data up to four times faster than Camera Link, and processes data 40% faster. With the world FOVLink with a large Camera, only a pair of high compared to the inspection 2500, the speed of tens of thousands of degrees of data at the prime phase speed machine is increased by 40% using CoaXpress ultra-high performance vision system

The MS-11 series uses 3D to check printing 7

The bending does not affect the detection

In the field of FOV, the bending state of the motherboard is automatically compensated, and the motherboard with bending can be accurately inspected. More in the tight FOV density without 3D off PCB results the bending state of the board can be checked normally according to the decomposition energy of the lens,can compensate 2mm to 5mm

Telecentric lens

Eliminate Perspective Error, block image distortion occurring around FOV, to ensure reliable 3D data

Closed loop System

The press/mounter can communicate solder position information to each other and real-time communication, and can fundamentally solve the problem of the system.

Quality management System

When defects occur,they can be analyzed in advance and controlled remotely, thus reducing the cost of producing defective products.

Simultaneous teaching of intelligent induction system parameters

The GUI teaching of simple and convenient image substrates and the teaching of precise parameter values of digital substrates can be selected according to the convenience of users.

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