YFX Machine - Professional SMT machine manufacturer providing one-stop solution.
NEW PEMTRON ATHNEA 3D AOI KOREA
First, key technological advantages
1, 8+4 projection +3 layers of 2D light sources
2, 2D and 3D synchronous detection algorithm
3. Telecentric lens provides high accuracy detection
4, high configuration CPU is enough to ensure fast image processing
5. Simple and clear user interface
6, built-in standard component library management system
7, offline real-time debugging system (option)
Second, advanced high speed detection and measurement technology
1, no shadow high-speed detection and measurement technology
PMP phase measurement technology (Moir fringe) has been used in Pemtron solder paste inspection systems for more than 10 years, and has extensive experience in 3D image processing and inspection.
The ATHENA Series 3D AOI is equipped with a 1 megapixel camera and an 8+4 projection system for 100% full 2D and 3D inspection of the PCB, guaranteeing complete shadow-free optical inspection and low false positive rates, while maintaining a highly flexible system function.
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2, high-speed detection technology
ATHENA uses advanced algorithms, advanced and powerful image processors, controllers and self-developed 10MP, 15um, 180fps telecentric lens cameras to achieve high-speed and stable testing.
3, high component detection technology
ATHENA's new 8+4 directional 3D projection technology provides industry-leading full range 3D inspection of 27mm component heights, with an optional Z-axis to detect components up to 60mm height.
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4. Shadowless 3D technology
Annular light sources and multi-projection systems can completely eliminate the shadow effects of high-density components and high components on the PCB.
5. Optical character recognition
By using the principle of optical color extraction and template comparison to identify Part Name of components, OCR fonts can be increased and modified to optimize the detection conditions of Part Name and better identify fonts.
6, 3D solder height measurement
Using Pemtron's advanced 3D technology, ATHENA was able to detect areas that traditional 2D AOI could not reach, increasing the test items for solder height, volume and component coplanarity, and greatly improving the detection ability of defective products.
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7. 3D pin detection
ATHENA detects the solder height and volume of the pin and provides high-quality, true-color 3D images.
8. 2D RGB algorithm
Through RGB color differentiation, the operator can more easily distinguish between air welding, foot warping and other bad.
Third, 3D automatic optical inspection system
1, the industry's highest precision and the strongest detection reliability
2, safe, accurate, real 3D imaging detection technology
3, high-density components, small components can be detected
4. True 3D molding technology that is nearly the same as the actual shape of the component
5. Side Camera can be used to realize side detection of components (option)
6, the top camera can not cover the tin foot internal poor detection
7, component library system is complete, convenient programming
8, offline real-time debugging system (option)
9. SMARTRON- Intelligent management system that supports test information big data management and real-time remote supervision
We are committed to producing the best quality products at the most competitive prices. Therefore, we sincerely invite all interested companies to contact us for more information.