YFX Machine - Professional SMT machine manufacturer providing one-stop solution.
The PCB spraying process mainly consists of two core processes: anti-corrosion paint coating and tin spraying, which are respectively used for protection and enhanced welding. The specific process involves key steps such as pre-treatment, spraying operation, curing, and post-treatment.
Three-anti-corrosion paint coating process flow
Preprocessing.
Cleaning: Use a dedicated cleaning agent or ultrasonic waves to remove oil, dust and ionic contamination from the PCB surface (standard requirement: ≤ 1.56 μg/cm²). 2
Baking the board: Preheat at 60℃ for 10-20 minutes to remove moisture and enhance the adhesion of the coating. 3 4
Shading: The non-coated areas (such as connectors) are protected using tape or a laser mask (with an accuracy of 50 μm). 2 4
Application implementation.
Method Selection:
Brush coating / Dip coating: Suitable for simple board shapes, but with low material utilization rate (dip coating loss reaches 40%). 2
Selective Spraying: Accuracy ± 0.1mm, suitable for components below 0402 or high-density boards. 2 5
Parameter Control: The spraying thickness is usually 25-75 μm. Be sure to avoid run-off or bubbles. 4 6
Solidification and Inspection.
Curing method: UV curing (dries within 3-5 seconds), thermal curing (gradually heated to 120℃), or moisture curing (humidity 40-60% RH). 2
Quality verification: Through X-ray thickness measurement (with an accuracy of ±1 μm) and salt spray test (no corrosion after 72 hours), etc. 2
Soldering process (HASL)
Preprocessing.
Micro-etching: Sodium peroxide solution corrodes the copper surface by 0.5 - 1 μm, enhancing the adhesion of the tin layer. 7 8
Soldering agent application: Uniform spraying to enhance the wetting property of the solder solution. 7
Soldering operation.
Immersion in tin: Immerse in tin solution at 265 ± 5℃ for 3 to 5 seconds (for lead-free process, it is a Sn96.5/Ag3/Cu0.5 alloy). 8
Hot air leveling: Using a high-pressure air knife at 280-300℃ to level the tin layer, with a thickness controlled at 1-3 μm. 8 9
Post-processing.
Cooling: Rapid cooling (> 4°C/second) is performed to stabilize the structure of the tin layer. 8
Cleaning: Remove residual soldering flux to prevent corrosion. 7
Process Selection Suggestions
Protection requirements: In high-reliability scenarios (such as automotive electronics), polyurethane or silicone three-layer anti-corrosion paint (with a temperature resistance range of 150-200°C) should be preferred. 2
Welding requirements: The tin spraying process has low cost and excellent welding performance, but for high-precision boards, it needs to be combined with processes such as gold plating.
Mirtec
Focus Distance
45mm
dimension
1080*1470*1560mmm(Length, width and height)
Field of view
54*50mm
power
1.1 KWkW
weight
About 950 kg
Power source
220V
illuminant
8 segments of coaxial lighting
noise
50 db
colour
white
Resolution
10/15 microns
Operating voltage
220V
Import or not
is
Processing customization
is
Effective pixel
15 million /25 million million
Country of origin
Import from Korea
Saleable land
The whole country
use
Test the SMT welding effect of PCBA with patch welding
Model number
MV-6e OMNI
UV UV curing device consists of a frame carrier, a transmission system, a light source system, a ventilation system, an electric box and a control system
The utility model is composed of three parts, which is a equipment for polymerization curing ultraviolet photocurable coatings, such as UV paint, UV glue, UV ink
Or UV varnish and so on. It has been widely used in printing, electronics, building materials, machinery and other industries. Curing efficiency depends on UV work
Factors such as rate, coating thickness, transport speed, type of substrate, and chemical properties of the photocured material.
1.3 1.31.3 1.3 Device Function Features Device Function Features Device function features
Open frame, easy to operate and maintain
Perfect safety design to minimize the damage of light leakage to personnel
Can flexibly choose 1-3 sets of lamps (divided into different models), upper/lower double-side curing
The power is adjustable without pole, which effec
Soldering range
Circuit board size: 48mm×48mm to 534mm×510mm (with dual transportation tracks) or 48mm×48mm to 534mm×610mm (with single transportation track). When the circuit board width exceeds 280mm, it automatically switches to the single transportation mode. 1
2
Production capacity
Capacity: Up to 47,000 cph (components/hour), depending on component size and type.
Number of component mounts: Up to 20 types of components (converted from 8mm tape). 1
2
Assembly accuracy
Accuracy: ±0.030mm (3σ), corresponding to component height ≤ 25.4mm. 1
2
High Precision Mode: ±0.038mm (3σ), achievable under specific conditions. 1
2
Machine configuration
Number of suction nozzles: 12 suction nozzles. 1
2
Module width: 320mm. 1
2
Machine dimensions: Length 1,295mm (M3III×4 or M6III×2), Width 1,900.2mm, Height 1,476mm. 1
2
Feeding System
Intelligent Feeder: Supports material belts with widths of 4, 8, 12, 16, 24, 32
High end SMT line solution : Decan s1 s2 l2 f2
High precision, easy line change, the best price-performance ratio, can be directly delivered to various countries around the world. Our company has a large Stock of new and old machines, ensuring stable supply without being restricted by regional regulations.