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Full Automatic On-line Selective Wave Soldering Sunflow Ds On-line Selective Electromagnetic Pump Wave Soldering
SUNFLOW3 在线式电磁泵选择性波峰焊 稳定高品质焊接Stable high guality soldering
Online selective soldering machine with electromagnetic pump SUNFLOW3
技术参数Specifications 特色与优势 -一焊接模块/Soldering module
型号Modle 名称Descriptior 详细参数 自主研发电磁泵
设备外形尺寸Overall dimensions(mm)(不含显示器和三色灯 2970(L)x1620(W)x1700(H)
稳定波峰高度
设备重量Equipment weight(kg 大约2000
PCB 顶部空间PCB top Side Clearance (mm 120 特殊材料喷嘴(可以使用3个月)
PCB 底部间隙/PCB bottom side clearance (mm 30 喷嘴拆换便捷
pCB 工艺边PCB technices Side (mm >3 极低的维修率
传送带距离地面高度Conveyor Height From Floor(mm) 850±25 特殊材料喷嘴 Special nozzle
PCB传送速度PCBConveyor Speed(m/min 0.2-10 Feature and advantage
PCB重量Max/PCBWeight(kg) ≤5
PCB厚度(包含治具)PCBThickness WithJig(mm) 1-6 ● Electromagnetic solder pump
传送带可调范围/Conveyor width adjustment(mm) 50-45( Stable wave height
传送带调宽方式/Conveyor width adjustment mode 电动/Electromotion ●Special solder nozzle(can use 3 months)
机体参数 PCB传送方向/PCB conveyor directior 左向右Left to right
General technical data 空气进气压力/Air input pressure(Mpa 06 ● Quick-change solder nozzles
氮气供应/Nitrogen suppl 由客户提供/Offered by customer ● Low maintains required
氮气进气压力/Nitrogen input pressure(Mpa 06
氮气消耗量/Nitrogen consumption(m3/h 1.5
所需氮气纯度/Required particle cleanliness(% >999gc
电源电压/Main voltage(VAC 380
频率/Frequency(HZ
最大功耗/Max power consumption(kw
50/60 传输系统Conveying system
<25
最大电流/Max amperage(A <34
环境温度/Ambient temperature(C 10-35 -传输轨道/Conveyor
机器噪音/Permanent sound level (dB <65
通讯接口/Communication interface SMEMA
焊接X轴最大行程/Max.Solder module x axis distance(mm) 510 滚轮 Roller
焊接Y轴最大行程/Max.Solder module y axis distance(mm) 450
焊接Z轴最大行程/Max.Solder module z axis distance(mm) 30
最小喷嘴外径/Smallest nozzle outer diameter(mm) 5.5
焊接系统 喷嘴内径/Nozzle inner diameter(mm 2.5-10
Soldering module 距PCB
最大波峰高度/Max solder wave height(mm
锡炉容量/Solder volume(kg) APProx:1zK9{Sn3PrE罗£# 板边更近
Close to PCB
最大焊接温度/Maxsolder temperature(°C 330 滚轮传输系统 Roller transport system
锡炉加热功率/Soldering heating power (kw 1.15 Sunflow 3集成了链条传输系统与滚轮传输系统。其
预热温度范围/Preheat temperature range(C) <200 中，在预热模组与喷雾模组采用链条传动。焊接模组采
预热系统 加热功率/Preheating medium(kw 21 用滚轮传动，可以极大的提升定位的准确性与重复精度。
Preheating module 加热方式/Preheating medium 热风+红外/Hotair+Infrarec Conveyor System combines chain and roller
顶部预热/Top side preheating 热风/Hotai
transports. Chain transport system is chosen in flux 喷雾X轴最大行程/Max.Flux module x axisdistance(mm)
51
喷雾Y轴最大行程/Max.Flux module y axis distance(mm 45( and preheating module. The soldering module use
喷雾系统 喷雾高度/Spray height(mm 60 the roller transport which performs good in location
Flux module 定位速度/Location speed(mm/s <400 board and repeatability.
喷嘴自动清洗功能/Spray head automatically cleaninc 程序控制/Programcontrol 链条传输系统Chain transport System
助焊剂箱体容量/Fluxcontent(L
完美预热 Perfectpreheating 选择性焊接工艺过程 Selective soldering process
预热模组/Preheating Module 焊接工艺 Working Process
运输PCB到喷雾模块 Transport the PCB to flux module
助焊剂喷嘴移动到指令位置，并对需要焊接的●Spray head moveto programed area and fluxis
位置进行选择性喷雾 applied only to the soldering joint to be made
上部热风与下部红外模组对PCB进行预热 Top -side and bottom-side preheat
电磁泵根据编程路径进行焊接 Programed electromagnetic pump soldering
Sunflow3将上部预热与下部预热结合在一起，对无铅焊接或 perfectly formed solderjoint
PCB传出 ● PCB is transported out
是多层PCB也有完美的表现。上部的热风预热已经在日东回流
焊上应用多年，性能稳定，它可以热量均匀的分散在PCB上。
下部红外预热可以根据PCB的大小来打开不同区域预热管，节 上部预热Top preheat上部预热Top preheat
省能量。同时焊接模块也提供上部热风预热，可以保证在整个
焊接过程中的预热温度，对完美发回助焊剂性能提供保障。 ↓↓↓↓ 思思
Sunflow 3 combines top heater and bottom heater and it still performs perfectly even for the lead-free soldering
or multi-layer boards. Top convection heater has been proved by Sun East Reflow machine for many years and
it can offer an even temperature distribution over the complete board. Bottom IR emitter heater provides ↑↑↑↑↑↑↑
optional heating area according the custom board. At the same time, another top heater covers the soldering
module and it can maintain the board temperature in all the cycle time 底部预热 Bottom preheat 焊接喷嘴Soldering head
助焊剂喷嘴Fluxhead
稳定高品质焊接Stable high guality soldering 进板 喷雾 预热 焊接 出板
Board ir Flux Preheat Soldering Board out
-焊接模块/Soldering Module 高精度喷雾Fluxing with high precision
Sunflow3采用电磁泵，相对于机械式泵，电磁泵运转
过程中波峰稳定，没有运动的机械磨损，产生的废渣很
喷雾模块/Flux module
少。此外焊接模组采用高精度的运动系统，来保证在焊 Sunflow3标准机采用的是精密滴喷嘴，可以均匀的将助焊剂喷
接过程中准确性，同时配合特殊的工艺，可以极大的消 射在所需的焊接区域。所喷助焊剂的区域可以是点也可以是某种
除连锡现象。在用户使用体验方面，Sunflow3提供 轨迹，最小的喷湿区域可以到2mm，可以最大程度减少助焊剂
焊接监视相机以及波峰高度自动检测功能，极大提升用 的消耗。根据用户的需要，在喷雾区域大面积低精度的情况下，
户体验。 Sunflow3也提供喷雾式喷嘴，使喷雾过程更加迅速。
焊接模组Soldering module
Sunflow 3 has programmable precision Flux Head to evenly apply
Sunflow 3 offers electromagnetic pum system.There is the flux. The application pattern can be point or track in standard
no moving mechanical parts in pump system, so dust machine. The atomizing nozzle can be chosen when the flux area
钢 is large and precision requirement is low. The flux is targeted to be
is little in process. The pump offer constant flow which applied only to the solder joint to be made and the wettable area
translates into stable wave height.The soldering module can be as small as 2mm. Thus flux consumption is reduced
has high precision axis system to ensure the accurate saving cost
soldering path and with particular process, the systenr
will eliminate the chance of bridging.Besides,process 所有模块运动都采用伺服与滚珠丝杆的方式传动，运动过程平
monitor screen and automatic soldering wave height 滑、稳定，重复精度可达0.05mm
焊接过程监视Monitoring the soldering proces: detecting are very friendly for users All the movements are drived by servo motor. The movements are
stable and smooth. The precision accuracy is around 0.05mm.
喷雾喷嘴 Spray nozzle 续(潮 Drio noz2 05 06
SUNFLOW DS 双电磁泵选择性波峰焊 稳定高品质焊接Stable high quality soldering
Selective soldering machine with dual electromagnetic pumps SUNFLOW Ds
焊接模块/Solderingmodule 特色与优势
技术参数Specifications
自主研发电磁泵
名称Description 详细参数Specifications 稳定波峰高度
型号Modle
设备外形尺寸/Overalldimensions(mm)(不含显示器和三色灯)2710(L)*1670(W)*1630(H 喷嘴拆换便捷
设备重量/Equipment weight(kg 2200 特殊材料喷嘴(可以使用3个月)
PCB 顶部间隙 PCB Top Side Clearance(mm 120 极低的维修率
PCB底部间隙 PCB Bottom Side Clearance (mm 40
PCB工艺边/PCB technics side (mm 33 双电磁泵设计,效率提升1倍
传送带距离地面高度Conveyor Height From Floor(mm 850±25 双喷头间距自动调整
PCB传送速度/PCBconveyor speed(mm/s 0.2-10
PCB重量Max/ PCB Weight(kg) 焊接过程可记录
PCB厚度(包含治具)PCB Thickness WithJig(mm) 1-0
传送带可调范围/Conveyor width adjustment (mm 50-450
传送带调宽方式/Conveyor width adjustment mode 电动/Electromotior Feature and advantage
PCB传送方向/PCBConveyor directior 左向右Left to right
机体参数 空气进气压力/Air input pressure(Mpa 06 Electromagnetic solder pump
General technical data 最大空气消耗量/Max Air Consumption(m3/h)
特殊材料喷嘴 Special nozzle 氮气供应/Nitrogen supply
由客户提供/Offered by customer Stable wave height
氮气进气压力/Nitrogen input pressure(Mpa) 0.6 Quick_change solder nozzles
氮气消耗量/Nitrogen consumption(m3/h) 1.5/锡炉
所需氮气纯度/Required particle cleanliness(%) .99.999 Special solder nozzle (can use 3 months)
废气排放量/Overall exhaust level(m3/h) 150*2 Low maintains required
电源电压/Main voltage(VAC 380
频率/Frequency(HZ 50/60 Double electromagnetic pump design with double efficiency
最大功耗/Max power consumption(kw) <3 Nozzle spacing automatic adjustment
最大电流/Max amperage(A) <60
环境温度/Ambient temperature(C 10-35 Welding process can be recorded
机器噪音/Permanent sound level (dB <65
通讯接口/Communication interface SMEMA
焊接X 轴最大行程/Max.Solder module x axis distance(mm) 51( 传输系统Conveying system
焊接Y轴最大行程/Max.Solder module y axis distance(mm) 450
焊接Z轴最大行程/Max.Solder module z axis distance(mm) 40
焊接系统 最小喷嘴外径/Smallest nozzle outer diameter(mm) 5.5
Soldering module 喷嘴内径/Nozzle inner diameter(mm) 2.5-10 -传输轨道/Conveyor
最大波峰高度/Max solder wave height (mm) ABB10x13g039264
锡炉容量/Solder volume(kg 滚轮 Roller
最大焊接温度/Max solder temperature(°C 330
锡炉加热功率/Soldering heating power(kw) 1.15/锡炉
预热温度范围/Preheat temperature range(C <200
预热系统 加热功率/Preheating medium(kw 24
Preheating module 加热方式/Preheating medium 热风+红外/Hot air+Infrarec
顶部预热/Top side preheating 热风/Hotai
喷雾X轴最大行程/Max.Flux module x axis distance(mm 510 距PCB
喷雾Y轴最大行程/Max.Flux module y axis distance(mm) 45(
喷雾系统 喷雾高度/Spray height(mm) 滚轮传输系统 Roller transport system 板边更近
Flux module 定位速度/Location speed(mm/s <400 Close to PCB
喷嘴自动清洗功能/Spray head automatically deaning 程序控制/Programcontrol
助焊剂箱体容量/Fluxcontent(L Sunflow DS 集成了链条传输系统与滚轮传输系统。其
中，在预热模组与喷雾模组采用链条传动。焊接模组采用
滚轮传动，可以极大的提升定位的准确性与重复精度。
Conveyor System combines chain and roller transports
Chain transport system is chosen in flux and preheating
module. The soldering module use the roller transport
链条传输系统 Chain transport System which performs good in location board and repeatability.
完美预热 Perfect preheating 选择性焊接工艺过程Selective soldering process
-预热模组/PreheatingModule 焊接工艺 Working Process
运输PCB到喷雾模块 Transport the PCB to flux module
助焊剂喷嘴移动到指令位置，并对需要焊接的●Spray head moveto programed areaand fluxis
位置进行选择性喷雾 applied only to the soldering joint to be made
上部热风与下部红外模组对PCB进行预热 ● Top -side and bottom-side preheat
电磁泵根据编程路径进行焊接 ● Programed electromagnetic pump soldering
perfectly formed solder joint
Sunflow DS将上部预热与下部预热结合在一起，对无铅焊接 PCB传出 ● PCB is transported out
或是多层PCB也有完美的表现。上部的热风预热已经在日东回流
焊上应用多年，性能稳定，它可以热量均匀的分散在PCB上。下 上部预热Top preheat上部预热Top preheat
部红外预热可以根据PCB的大小来打开不同区域预热管，节省能
量。同时焊接模块也提供上部热风预热，可以保证在整个焊接过 ↓ 思思
程中的预热温度，对完美发挥助焊剂性能提供保障
Sunflow DS combines top heater and bottom heater and it still performs perfectly even for the lead-free soldering
or multi-layer boards. Top convection heater has been proved by Sun East Reflow machine for many years and it ↑↑↑↑↑↑↑
can offer an even temperature distribution over the complete board. Bottom IR emitter heater provides optiona
heating area according the custom board. At the same time, another top heater covers the soldering module and it 助焊剂喷嘴 Flux head 底部预热 Bottom preheat 焊接喷嘴Soldering head
can maintain the board temperature in all the cycle time
进板 喷雾 预热 焊接 出板
稳定高品质焊接stable high guality soldering Board in Flu> Preheat Soldering Board out
焊接模块/SolderingModule 高精度喷雾Fluxing with high precision
喷雾模块/Fluxmodule
SUNFLOW DS标准机采用德国进口精密滴喷嘴，喷口直径
130μm，可以均匀的将助焊剂喷射在所需要焊接区域。最小
喷射区域3mm，比传统喷雾节省至少90%助焊剂。根据用户
需求，在喷雾区域大面积低精度的情况下，SUNFLOWDS
也提供喷雾式喷嘴，使喷雾过程更加迅速。
The SUNFLOW DS standard machine adopts precise nozzle
焊接模组Soldering module 焊接过程监视Monitoring the soldering process
with 130 um diameter which is imported from Germany and
can uniformly spray flux in the required welding area. The
SUNFLOWDS采用电磁泵，相对于机械式泵，电磁泵 SUNFLOW DS offers electromagnetic pump system minimum injection area is 3mm which saves at least 90%
运转过程中波峰稳定，没有运动的机械磨损，产生的废 There is no moving mechanical parts in pump system flux compared with the traditional spraying
渣很少。此外焊接模组采用高精度的运动系统，来保证 so dust is little in process. The pump offer constant flow
which translates into stable wave height. The soldering 所有模块运动都采用伺服与滚珠丝杆的方式传动 在焊接过程中准确性，同时配合特殊的工艺，可以极大
module has high precision axis system to ensure the
的消除连锡现象。在用户使用体验方面，SUNFLOWDS accurate soldering path and with particular process, the 运动过程平滑、稳定，重复精度可达0.05mm
提供焊接监视相机以及波峰高度自动检测功能，极大提 system will eliminate the chance of bridging. Besides All the movements are drived by servo motor. The
升用户体验. process monitor screen and automatic soldering wave movements are stable and smooth. The precision
height detecting are very friendly for users accuracy is around 0.05mm.
德雾防堵检测Soray blockina d 滴喷嘴Drip nozzle
12
Full automatic on-line selective wave soldering SUNFLOW DS on-line selective electromagnetic pump wave soldering
Online selective wave soldering SUNFLOW DS Features:
Spray, preheat and welding units are standard, allowing the entire welding process to be completed in a small machine space.
The rotary track design allows the operator to complete PCB loading and unloading on the same side of the machine.
Small footprint, much shorter than standard SUNFLOW system machines.
Welding process real-time monitoring, process recording.
Nitto on-line wave soldering
Automatic online selective wave soldering advantages:
1, three independent module composition, standard independent spray, preheating, welding module.
2, can be continuous plate, up to 3 plates can be entered at the same time, high welding efficiency.
3, standard spray cleaning function.
4, standard spray detection function.
5, standard online teaching programming function.
6, the welding module is equipped with two identical tin furnaces, and two blocks are connected at the same time. High efficiency,
7. The minimum spacing between two nozzles is 95mm.
Nitto on-line wave soldering module
On-line selective wave soldering workflow
1, the PCB circuit board of the inserted components is transferred to the selective wave peak machine by the board entry device at the entrance of the machine;
2, PCB board is transferred to the spray zero stage, XY direction positioning to tighten, according to the pre-programmed process for selective fog:
3, after the spray is completed, the PCB is transferred to the preheating stage for flux activation and removal of volatiles. According to the characteristics of the substrate, set the appropriate temperature to heat the PCB to the wetting temperature;
4. After preheating, the PCB is transferred to the welding stage. After clamping in the three directions of XZ, the PCB does not move, and the two tin furnaces are driven by the XYZ platform for spot welding or drag welding according to the pre-programmed program. The ammonia protection on the tin water surface can effectively improve the welding quality and reduce the amount of tin slag:
5. After welding is completed, XYZ positioning is loosened and PCB is released.
On-line selective wave soldering workflow.jpg
Select welding components Welding module features:
1, the use of miniature electromagnetic pump tin furnace, tin wave high, large flow, wave peak stability, point penetration depth, infiltration and brazing force;
2, nozzle periphery and solder surface with nitrogen filling protection, can improve the solderability of lead-free solder, and can reduce the production of tin slag to prevent nozzle plug, save welding costs and labor costs,
3, high temperature resistance, corrosion resistance unique nozzle, strong oxidation resistance, good infiltration, normal use time of up to 3 months.
4, automatic detection of solder liquid level height, to ensure the stability of the wave crest.
5, with brilliant point slimming function.
6, standard with two CCD cameras, used to monitor the connection status and PCB positioning programming
The characteristics of Nitto on-line wave soldering are introduced
Full automatic on-line selective wave soldering SUNFLOW DS on-line selective electromagnetic pump wave soldering
Online selective wave soldering SUNFLOW DS Features:
Spray, preheat and welding units are standard, allowing the entire welding process to be completed in a small machine space.
The rotary track design allows the operator to complete PCB loading and unloading on the same side of the machine.
Small footprint, much shorter than standard SUNFLOW system machines.
Welding process real-time monitoring, process recording.
Nitto on-line wave soldering
Automatic online selective wave soldering advantages:
1, three independent module composition, standard independent spray, preheating, welding module.
2, can be continuous plate, up to 3 plates can be entered at the same time, high welding efficiency.
3, standard spray cleaning function.
4, standard spray detection function.
5, standard online teaching programming function.
6, the welding module is equipped with two identical tin furnaces, and two blocks are connected at the same time. High efficiency,
7. The minimum spacing between two nozzles is 95mm.
Nitto on-line wave soldering module
On-line selective wave soldering workflow
1, the PCB circuit board of the inserted components is transferred to the selective wave peak machine by the board entry device at the entrance of the machine;
2, PCB board is transferred to the spray zero stage, XY direction positioning to tighten, according to the pre-programmed process for selective fog:
3, after the spray is completed, the PCB is transferred to the preheating stage for flux activation and removal of volatiles. According to the characteristics of the substrate, set the appropriate temperature to heat the PCB to the wetting temperature;
4. After preheating, the PCB is transferred to the welding stage. After clamping in the three directions of XZ, the PCB does not move, and the two tin furnaces are driven by the XYZ platform for spot welding or drag welding according to the pre-programmed program. The ammonia protection on the tin water surface can effectively improve the welding quality and reduce the amount of tin slag:
5. After welding is completed, XYZ positioning is loosened and PCB is released.
On-line selective wave soldering workflow.jpg
Select welding components Welding module features:
1, the use of miniature electromagnetic pump tin furnace, tin wave high, large flow, wave peak stability, point penetration depth, infiltration and brazing force;
2, nozzle periphery and solder surface with nitrogen filling protection, can improve the solderability of lead-free solder, and can reduce the production of tin slag to prevent nozzle plug, save welding costs and labor costs,
3, high temperature resistance, corrosion resistance unique nozzle, strong oxidation resistance, good infiltration, normal use time of up to 3 months.
4, automatic detection of solder liquid level height, to ensure the stability of the wave crest.
5, with brilliant point slimming function.
6, standard with two CCD cameras, used to monitor the connection status and PCB positioning programming
The characteristics of Nitto on-line wave soldering are introduced
We are committed to producing the best quality products at the most competitive prices. Therefore, we sincerely invite all interested companies to contact us for more information.