Low Cost Bga Rework Station Mw-750 Bga Rework Station Smt Smd Soldering Station Repair Machine

Main technical features:

​Integrated design of hot air head and mounting head, with automatic mounting, automatic welding and automatic disassembly functions;

​The upper part of the hot air system, heating up fast, uniform temperature, cooling fast (cooling can drop suddenly 50-80 degrees), better meet the process requirements of lead-free welding. Infrared + hot air mixture heating is used in the lower heat area, infrared directly acts on the heating area, and conducts the hot air at the same time, which can make up for the mutual deficiency, making the PCB temperature rise fast (heating rate of 10℃/S), while the temperature is still uniform;

​Independent three temperature zone (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and the lower temperature zone realize synchronous automatic movement, and can automatically reach any position in the bottom infrared preheating zone. The lower temperature area can move up and down, support PCB, and adopt motor automatic control. The PCB does not move on the fixture, and the upper and lower heating head can be moved to the target chip of the PCB. PCB board adopts high precision slider to ensure the accuracy of BGA and PCB board.

​The original bottom preheating platform, the use of excellent heating materials imported from Germany (infrared gold-plated light tube)+ anti-glare constant temperature glass (temperature up to 1800℃) preheating area of 500*420mm, preheating platform, plywood device and cooling system can be moved in the X direction. Make PCB positioning, folding welding more safe and convenient;

​X,Y use the motor automatic control movement mode, so that the alignment is fast and convenient, the equipment space is fully utilized, the relatively small equipment volume to achieve large area PCB repair, the maximum cleat size up to 510*480mm, no repair dead Angle;

​Dual rocker control, alignment lens and upper and lower heating platform to ensure alignment accuracy;

​Built-in vacuum pump, φangle rotation, fine tuning mount nozzle;

​The suction nozzle automatically identifies the suction and mounting height, and the pressure can be controlled within the tiny range of 10 grams, with 0 pressure suction and mounting functions for small chips;

​Color optical vision system with manual X, Y direction movement, with splitting two-color, magnifying and fine-tuning functions, including color difference resolution device, auto focus, software operation functions, can be repaired the maximum BGA size 80*80 mm;

​A variety of sizes of alloy hot air nozzle, easy to replace, 360° rotation positioning;

​Equipped with 5 temperature measuring ports, with multi-point real-time temperature monitoring and analysis function; With solid-state operation display function, temperature control is more safe and reliable;

​The machine can automatically generate SMT standard temperature disassembly curve at different temperatures in different regions, without manual setting of machine curve, and can be used by experienced operators to realize machine intelligence; Camera with observation of the melting point of the side of the tin ball for easy curve determination (this feature is optional)