Original New For Smt Machine Pansonic npm-d3a Npm-w2 Npm-tt2 2-year Warranty

NPM Series (New Generation) NPM-D3, NPM-W2, NPM-TT
High-speed and high-precision processing
Mobile phones, automotive electronics, various small-batch products
CM series (classic model) CM602, CM402
Modular main force
Appliances, communication modules, large-scale mass production
II. 5 Major Technical Features of Panasonic Soldering Machines
"Double-track" high-capacity design
The new NPM series mostly adopts the dual-track (Dual-Lane) design. When one track is for soldering, the other can simultaneously move the board up and down. The theoretical production capacity can reach up to 171,000 CPH, and the output rate per unit area is at the top of the industry.
Support for micro components and irregular parts
Supports from 01005 (metric 0402) micro chips to 150mm long connectors. By combining with a multi-functional head, it can easily handle irregular components such as BGA, QFN, and LED lamp boards, with extremely wide compatibility.
Automatic compensation for board warping (Z-Tracking)
For large-sized boards or flexible boards with warping problems, the equipment has a non-contact height sensor that can scan the PCB surface in real time and automatically adjust the soldering depth, effectively preventing short circuits. This is very important for automotive boards.
Modularization and scalability
In particular, the CM402/602 series adopts a modular platform. At the site, by replacing the soldering head and feeder, it can flexibly switch between "high-speed machine" and "general-purpose machine" modes to adapt to order changes.
Closed-loop feedback system
Supports data linkage with front-end and back-end equipment (such as your Kohyoung SPI) to achieve APC (automatic process correction), and automatically fine-tune the soldering pressure or position based on the solder paste inspection results.
III. Production Line Deployment Suggestions
New line selection: If making precision products such as mobile phones and smart wearables, the NPM series (such as NPM-W2) is the first choice. It has better yield control for 01005 components.
Second-hand cost-effectiveness: There are a large number of CM402 models circulating in Dongguan and its surrounding areas. This model is durable and reliable, with cheap accessories, making it very suitable for industrial control, power supplies, and other regular products. It is a high-cost-effective choice for beginners or expansion.
Line coordination: The coordination between Panasonic soldering machines and Kohyoung SPI is very high. It can achieve a closed-loop of "solder paste inspection - soldering compensation", and it is recommended to turn on this function in the software to improve the pass rate.

Panasonic NPM-W2 is a high-speed modular surface mount machine in the NPM series. Compared to the previous W/WX models, it has significant improvements in precision (supporting ±25µm) and miniaturization (03015). The following are its core English technical specifications (Specifications), which are suitable for the selection evaluation of the Dongguan factory or for technical documentation. 1. Core Performance (Head-Dependent)
The NPM-W2 adopts a dual gantry design, and its performance varies greatly depending on the configuration of the mounting head. The standard configuration, which is the most common on the South China production line, is a twin head setup: Head Configuration
Max. Speed (cph)
Placement Accuracy (Cpk≥1)
Min. Component
Notes
16-nozzle (Lightweight) x2​
77,000​ (0.047 seconds per chip) ±40 µm (High-Speed) / ±30 µm​ (Precision)
03015 / 0402
Main players in mobile phones and wearable devices 12-nozzle x2​
64,50 ±40 µm
0402 ~ 12x12x6.5mm
General-purpose balancing configuration 8-nozzle x2​
40,00 ±40 µm (Chip) / ±30 µm (QFP)
0402 ~ 32x32x12mm
Mixed-type 3-nozzle x2​
11,000 (QFP) ±30 µm (QFP)
0603 ~ 150x25x28mm​
For large components and connectors
Note: The measured speed according to the IPC9850 standard (for 1608 chips) is approximately 59,200 cph (16 heads) to 48,000 cph (12 heads). 2. Board Handling & Feeder System
PCB Size (Single Lane): L 50 ~ 750 × W 50 ~ 550 mm (Batch mounting)
PCB Size (Dual Lane): L 50 ~ 750 × W 50 ~ 260 mm (Dual-lane transfer)
Feeder Base: 8mm tape (Max. 120 reels with double cart), 12/16/24/32/44/56mm tape
Tray Feeder: Max. 20 types (Single) / 40 types (Double)
Stick Feeder: Max. 14 types (Cart type)
3. Utility & Physical Data
Power Supply: 3-phase AC 200/220/380/400/420/480 V, 2.8 kVA
Air Pressure: Minimum 0.5 MPa, Consumption ~200 L/min (ANR)
Dimensions (Width × Depth × Height): Approximately 1,280 × 2,332 × 1,444 mm (main unit only)
Weight: Approximately 2,470 kg (varies with options) 4. Key Features (English Description)
Multi-Recognition Camera: Integrates 2D alignment, component thickness, and 3D coplanarity measurement​ (critical for BGA/QFN lead inspection).
Dual-Lane Flexibility: Supports Alternate Mounting​ (heads work on both lanes) and Independent Mounting​ (each head dedicated to one lane).
APC (Advanced Process Control): Real-time feedback system for board warpage and component deviation compensation.
Component Range: From 03015​ micro chips to large connectors up to L150 × W25 × T30 mm.
5. Landing Model Selection Suggestions
Precision production line (mobile phone/automobile): The 16-nozzle head must be selected and the high-precision mode (±30µm) must be enabled to ensure stable production of 03015 components.
Key points for second-hand inspection: NPM-W2 has a large circulation volume in the second-hand market. During inspection, the 3D coplanarity detection function and the stepping precision of 8mm flywheel need to be tested as priorities.
Line matching: NPM-W2 supports data loopback with Kohyoung SPI and can automatically adjust the mounting coordinates according to the solder paste offset.