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The PCB spraying process mainly consists of two core processes: anti-corrosion paint coating and tin spraying, which are respectively used for protection and enhanced welding. The specific process involves key steps such as pre-treatment, spraying operation, curing, and post-treatment.
Three-anti-corrosion paint coating process flow
Preprocessing.
Cleaning: Use a dedicated cleaning agent or ultrasonic waves to remove oil, dust and ionic contamination from the PCB surface (standard requirement: ≤ 1.56 μg/cm²). 2
Baking the board: Preheat at 60℃ for 10-20 minutes to remove moisture and enhance the adhesion of the coating. 3 4
Shading: The non-coated areas (such as connectors) are protected using tape or a laser mask (with an accuracy of 50 μm). 2 4
Application implementation.
Method Selection:
Brush coating / Dip coating: Suitable for simple board shapes, but with low material utilization rate (dip coating loss reaches 40%). 2
Selective Spraying: Accuracy ± 0.1mm, suitable for components below 0402 or high-density boards. 2 5
Parameter Control: The spraying thickness is usually 25-75 μm. Be sure to avoid run-off or bubbles. 4 6
Solidification and Inspection.
Curing method: UV curing (dries within 3-5 seconds), thermal curing (gradually heated to 120℃), or moisture curing (humidity 40-60% RH). 2
Quality verification: Through X-ray thickness measurement (with an accuracy of ±1 μm) and salt spray test (no corrosion after 72 hours), etc. 2
Soldering process (HASL)
Preprocessing.
Micro-etching: Sodium peroxide solution corrodes the copper surface by 0.5 - 1 μm, enhancing the adhesion of the tin layer. 7 8
Soldering agent application: Uniform spraying to enhance the wetting property of the solder solution. 7
Soldering operation.
Immersion in tin: Immerse in tin solution at 265 ± 5℃ for 3 to 5 seconds (for lead-free process, it is a Sn96.5/Ag3/Cu0.5 alloy). 8
Hot air leveling: Using a high-pressure air knife at 280-300℃ to level the tin layer, with a thickness controlled at 1-3 μm. 8 9
Post-processing.
Cooling: Rapid cooling (> 4°C/second) is performed to stabilize the structure of the tin layer. 8
Cleaning: Remove residual soldering flux to prevent corrosion. 7
Process Selection Suggestions
Protection requirements: In high-reliability scenarios (such as automotive electronics), polyurethane or silicone three-layer anti-corrosion paint (with a temperature resistance range of 150-200°C) should be preferred. 2
Welding requirements: The tin spraying process has low cost and excellent welding performance, but for high-precision boards, it needs to be combined with processes such as gold plating.
The core advantages lie in intelligent nitrogen control and modular preheating. It can precisely manage the welding process and optimize nitrogen consumption, making it particularly suitable for scenarios with high requirements for welding quality. It adopts freely defined spraying mode to achieve precise and economical flux deposition. It also comes with an external flux-assisting module with an independent exhaust device, which is separated from the process pipeline and has high flexibility.
In addition, its preheating configuration is modular, with repeatable and stable heat transfer; the solder nozzle combination can be adapted to various application requirements; the chain conveyor system is sturdy and durable, with automatic lubrication; the process pipeline is made of sta
Combined, these features extend the component range down to the 03015mm microchip, yet preserve capability up to 120x90mm components up to 40mm tall and nearly 6” long (150mm) connectors.
Manual soldering workstation
It heats up quickly and has high durability
Hanwha Hm520 Pick And Place Machine
Hanwha Decan S2 S1 Pick And Place Machine
have high speed and production capacity of the Panasonic D3A are comparable to those of the new machine, but its price is only half of that of the new model.
1. Improved productivity.
With the high-speed XY manipulator and tape feeder, as well as the use of the newly developed "Fixed On-the-fly camera", the mounting capability of all components, from small components to large shaped components, can be improved.
In addition, with the new high-speed working head "H24 working head", the component mounting capacity of each module is up to 35,000CPH*, which is about 35% more than the NXT II.
2, corresponding to 03015 components, mounting accuracy ±25μm*
The NXT III not only corresponds to the smallest 0402 components used in production today, but also fits the next generation 03015 ultra-small components.
In addition, through the use of more rigid machine construction than existing models, independent servo control technology and component image recognition technology, can achieve the industry's best small chip mounting accuracy: ±25μm* (3σ) Cpk≧1.00
3, improve the operability
Inheriting the lang
Free 4 sets of universal fixture, easy to fix PCB cutting
01. Substrate size: Max.:500×350(400)mm (Min.:100×80 mm)
02. Substrate flow direction: left → right
03. Substrate positioning mode: visual automatic positioning
04.X.Y Positioning accuracy: 0.05mm @3 Sigma
05.X.Y repetition accuracy: 0.02mm @ 3 Sigma
06.X.Y axis speed: 500mm/sec
07. Conveyor belt height: 900 ± 20 mm
08. Control mode: X-Y-Z 3-axis AC servo motor
09. Operation mode: PC WINDOWS platform, humanized
10. Dispensing speed: Max.14400 DPH
11. Power supply: single-phase AC 220V 50/60Hz 1KW
12. Air pressure: 4-6 kg/cm2 consumption of 0.3m3/min
13. External dimension (W×D×H) : 1350×1200×1650mm
14. Weight: 800 kg
Eili EM5700N online circuit board cutting machine |PCB splitter
Basic specification
01. X, Y cutting speed: 1 ~100mm/s
02. Machine repeatability: ± 0.01mm
03.X, Y, Z control mode: industrial IPC and PC
04. X, Y, Z drive mode: AC servo motor a
05. Man-machine operation and data storage: PC system
06. Cutting accuracy: ± 0.1mm
07. Spindle spee
Original New Pick and place machine
Panasonic am100 160 Feeder station is currently the best in the industry. With 4 transport vehicles
Can handle materials of different sizes.
It is the ideal choice for prototyping small batch production multiple batches
High-precision PCB products.The Germany Dek Horizon 03i SMT SMD ASM Automatic Solder Paste Stencil Printer Machine is a precision equipment designed to enhance the efficiency and accuracy of solder paste application in surface mount technology (SMT) assembly. With its advanced automation features, this printer ensures consistent results and minimizes manual labor, making it an essential tool for high-volume production environments.