YFX Machine - Professional SMT machine manufacturer providing one-stop solution.
SMT equipment utilized in the electronics manufacturing industry for mounting electronic components directly onto the surface of printed circuit boards (PCBs), as opposed to traditional through-hole technology. This process involves several key steps and corresponding equipment:
• Pick and Place Machines: These highly accurate robots pick up tiny components from feeders and precisely place them onto the PCB, following a predefined program derived from the circuit design.
• Reflow Ovens: After component placement, PCBs are passed through reflow ovens where controlled heat melts solder paste, creating strong electrical connections between components and the board.
• SMT Stencil Printer: Prior to component placement, solder paste or adhesive is evenly deposited onto the board using a steel or polymer mesh screen, ensuring precise application.
• Inspection Systems: AOI and X-ray Inspection systems meticulously scan PCBs for defects, such as missing, misplaced, or incorrectly oriented components, as well as soldering issues.
YFX Machine as one of the SMT equipment manufacturers, provides a range of smt manufacturing equipment, welcome to contact us.
The new NPM series mostly adopts the dual-track (Dual-Lane) design. When one track is for soldering, the other can simultaneously move the board up and down. The theoretical production capacity can reach up to 171,000 CPH, and the output rate per unit area is at the top of the industry.
Support for micro components and irregular parts
Supports from 01005 (metric 0402) micro chips to 150mm long connectors. By combining with a multi-functional head, it can easily handle irregular components such as BGA, QFN, and LED lamp boards, with extremely wide compatibility.
Automatic compensation for board warping (Z-Tracking)
For large-sized boards or flexible boards with warping problems, the equipment has a non-contact height sensor that can scan the PCB surface in real time and automatically adjust the soldering depth, effectively preventing short circuits. This is very important for automotive boards.
High- end Shelving Rack Plc And Motor Core Components
DI Makeing Water Machine
Used in semiconductor SMT and other superconducting industries
Supports simultaneous mounting of components of different sizes. Multi-functional surface mount machine.
I. Core Performance Parameters
Soldering Speed: Chip components can reach 42,000 CPH (in accordance with IPC9850 standards), with high efficiency.
Soldering Accuracy: Chip/IC components can achieve ±50 µm (Cpk 1.0), capable of handling components ranging from 0402 to 14mm in size.
PCB Board Support: Standardly supports L510×W250 (2 LANE) or L510×W460 (1 LANE), with the maximum reaching L610×W460 (1 LANE).
II. Hardware and Functional Design
Dual Mechanical Arm Drive: There are 12 soldering heads. When a single head malfunctions, the other heads can automatically take over, reducing downti