Parmi Xceed 3d Aoi Machine - Original Japanese Automated Optical Inspection Equipment For Smt Manufacturing

 Japan  PARMI Xceed 3D AOI is an advanced online optical inspection device, mainly used for 3D automatic optical inspection in SMT (Surface Mount Technology) production lines. The following is a brief introduction to its main features and technical specifications:

### 1. Core Performance and Technical Specifications
- ** Dual Laser light Source projection technology ** : It adopts a 4-megapixel high-resolution CMOS lens, combined with RGBW LED light source and telecentric lens to ensure high-precision imaging.
- ** Ultra-high-speed detection ** : The industry-leading detection speed reaches **65cm²/sec** (with a resolution of 14μm), and the detection time for a standard 260mm × 200mm PCB is only 10 seconds (including the time for board entry and exit).
- **Real 3D Imaging ** : Advanced signal processing technology provides noise-free high-definition 3D images, unaffected by PCB material, color or surface.

### 2. Detection Capability
- ** Comprehensive coverage of defect types ** : Can detect missing parts, pin warping, component size/tilt, side flip, tombstone, reverse, polarity error, solder joint defects (soldering, bridging), text recognition (OCR/OCV), etc.
- ** Overcome the limitations of 2D AOI ** : Through height measurement data, accurately identify three-dimensional defects such as pin warping and component tilting that are difficult to detect with traditional 2D.

### 3. User-friendly Design
- ** One-click programming ** : The interface is compatible with the PARMI SPI detection program and supports the automatic generation of the detection area (ROI), simplifying the operation process.
- ** Barcode /Badmark Recognition ** : Integrated 1D/2D/QR code scanning function to enhance production efficiency.

### 4. Application and Market Recognition
It is widely used in the electronics manufacturing industry, especially excelling in the detection of solder joint defects and low-contrast components, and enjoys high recognition in the global electronics industry.
We offer SMT full-line supporting services, including equipment leasing and workshop planning support.

Introduction to the key parameters and technical specifications of PARMI Xceed 3D AOI**, applicable to the high-precision SMT inspection requirements in the electronics manufacturing industry:

---

### 1. Core Hardware parameters
- "Optical System
- ** Light Source Type ** : RGBW LED + dual laser (a total of 8 light source combinations)
- ** Camera Resolution ** : 4-megapixel high-resolution CMOS (supports selectable resolutions ranging from 14μm to 35μm)
- ** Lens ** : Telecentric lens, eliminating perspective error
- 3D Imaging technology:
- ** Height measurement accuracy ** : ±1μm (Repeatability accuracy
- ** Scanning speed ** : Up to 65cm²/ second (at a resolution of 14μm)

---

### 2. Test performance parameters
- ** Detection range ** :
- **PCB Size ** : Minimum 50mm × 50mm, maximum 510mm × 460mm (Customizable for larger sizes)
- ** Component height range ** : 0-30mm (Can measure high components such as QFN, BGA, Connector, etc.)
- ** Detection speed **
- Full inspection time for standard PCB (260mm × 200mm) : ≤10 seconds (including board entry and exit)
- ** Defect Detection rate **
It can identify missing parts, upright tombstones, side flipping, warped pins, insufficient or excessive solder, bridging, polarity errors, etc., with a false alarm rate of less than 1%.

---

### 3. Software and Automation Functions
- ** Programming efficiency **
- Support one-click import of CAD/Gerber data and automatically generate the detection area (ROI)
- Compatible with the PARMI SPI (solder paste testing equipment) program to reduce debugging time
- "Intelligent Analysis"
The 3D+2D hybrid algorithm supports the analysis of solder joint volume, height and shape
- Built-in OCR/OCV (Character Recognition and Verification) function

---

### 4. Mechanical and Interface Parameters
- ** Transmission System ** :
Double-track conveyor belt, supporting plate thickness 0.3 to 6mm, maximum plate weight 3kg
- Direction of plate entry: left → right or right → left (adjustable)
- ** Communication Interface ** :
Supports SECS/GEM and TCP/IP protocols, and is compatible with MES/ factory Internet of Things systems

---

### 5. Environment and Power Consumption
- ** Power Supply Requirements ** : AC 220V±10%, 50/60Hz, power consumption ≤1.5kW
- ** Working Environment ** : Temperature 15-30℃, Humidity 30-70% RH (no condensation)

---

### 6. Summary of Advantages
- ** High Precision ** : Dual laser +RGBW light source, solving the problem of detecting low-contrast components.
- ** High Efficiency ** : Ultra-high-speed scanning is suitable for mass production scenarios.
- ** Usability ** : Automated programming reduces reliance on the operator's experience.

If specific model differences are needed (such as Xceed 7 series or 9 series)