KOREA SEC 3D XARY EYE S160F (Ⅰ)
X-Ray CT Integrated Inspection System | Main Technical Specs
2026-06-03
X-ray Inspection System with Computed Tomography Module
The technological equipment is intended for non-destructive testing of soldered joints of surface-mount components in various packages: BGA, QFN, QFP, SO, etc.; research of the internal structure of printed circuit boards and electronic components; support for work with low-density materials, including plastics, ceramics, optical elements, small cast parts made of titanium and aluminum; quality control of soldering for through-hole components; performing both standard X-ray (2D inspection) and computed tomography inspection; conducting 3D measurements and analysis.
Part 1: MAIN TECHNICAL CHARACTERISTICS OF THE EQUIPMENT
Requirements established by the Buyer for the technical characteristics of the Equipment, requirements for functional characteristics (consumer properties), dimensions, and other indicators related to determining compliance of the supplied Equipment with the Buyer's needs are specified in Table 1.
Equipment Requirements – [to be filled by Supplier].
TABLE 1: Technical Parameters and Requirements
| No. | Parameter Name | Condition | Unit | Value |
| 1 | Open-type microfocus X-ray tube | Exactly | – | Present |
| 2 | Maximum accelerating voltage of X-ray tube | Not less than | kV | 160 |
| 3 | Maximum current of X-ray tube | Not less than | µA | 1000 |
| 4 | Real-time display of acquired X-ray images | Exactly | – | Present |
| 5 | Minimum focal spot size | Not more than | µm | 4 |
| 6 | Maximum power of X-ray tube | Not less than | W | 64 |
| 7 | Maximum power on target | Not less than | W | 10 |
| 8 | Minimum distance from focal point to object | Not more than | µm | 300 |
| 9 | Minimum distance from focal point to detector | Not more than | mm | 50 |
| 10 | System resolution | Not more than | µm | 0.95 |
| 11 | Maximum angle of X-ray beam emission | Not less than | degrees | 170 |
| 12 | Minimum focusing | Not more than | µm | 1 |
| 13 | Overall dimensions of the installation (range): *length × width × height | From – to | mm | 1400–1600 × 1550–1750 × 1900–2350 |
| 14 | Maximum system weight | Not more than | kg | 3200 |
| 15 | Detector type – digital flat-panel | Exactly | – | Present |
| 16 | Pixel matrix resolution | Not less than | pixels | 1536 × 1536 |
| 17 | Active area size of detector | Not less than | mm | 153 × 153 |
| 18 | Maximum ADC bit depth of digital detector | Not less than | bits | 16 |
| 19 | Frame rate of images from digital detector | Not less than | fps | 60 |
| 20 | Detector pixel size | Not more than | µm | 100 |
| 21 | Detector dynamic range | Not less than | dB | 64 |
| 22 | Maximum number of frame accumulations | Not less than | pcs. | 64 |
| 23 | Detector dimensions (L × W × H) | Not more than | mm | 187 × 183 × 53 |
| 24 | Worktable size for sample placement (L × W) | Not less than | mm | 630 × 630 |
| 25 | Maximum weight of inspected sample | Not less than | kg | 10 |
| 26 | Maximum height of inspected sample | Not less than | mm | 150 |
| 27 | Minimum acquisition time (tomography) | Not more than | sec | 20 |
| 28 | Minimum reconstruction time | Not more than | sec | 30 |
| 29 | Maximum sample size | Not less than | mm | 600 × 600 |
| 30 | Maximum mass of inspected sample | Not less than | kg | 10 |
| 31 | Maximum height of inspected sample | Not less than | mm | 150 |
| 32 | Active inspection area of worktable (L × W) | Not less than | mm | 500 × 500 |
| 33 | Geometric magnification | Not less than | × | 2000 |
| 34 | Maximum detector tilt angle relative to sample | Not less than | degrees | 65 |
| 35 | Number of degrees of freedom during sample inspection | Not less than | – | 6 |
| 36 | Worktable travel range along X and Y axes | From – to | mm | 0 – 500 |
| 37 | Detector travel range along Z axis | From – to | mm | 0 – 300 |
| 38 | X-ray tube travel range along Z axis | From – to | mm | 0 – 120 |
| 39 | Digital detector rotation range relative to inspected sample | From – to | degrees | 0 – 360 |
| 40 | Minimum radiation dose rate at 100 mm from housing | Not more than | µSv/hour | 1 |
| 41 | Door-open sensors on service doors | Exactly | – | Present |
| 42 | Software module for 2D void detection | Exactly | – | Present |
| 43 | Resolution of built-in navigation camera | Not less than | pixels | 4024 × 3036 |
| 44 | Power consumption | Not more than | kW | 4 |
| 45 | Supply voltage | Exactly | V | 220 ±10% |
| 46 | Built-in display diagonal size | Not less than | inches | 27 |
| 47 | Rotation option for CT (Planar type) | Exactly | – | Present |
| 48 | Basic CT functionality | Exactly | – | Present |
| 49 | Software module for automatic defect correction in 3D models | Exactly | – | Present |
| 50 | Computer workstation for CT reconstruction and analysis | Exactly | – | Present |
| 51 | Maximum PC hard drive capacity | Not less than | TB | 1 |
| 52 | PC RAM capacity | Not less than | GB | 16 |
| 53 | PC graphics card memory | Not less than | GB | 8 |
| 54 | Vibration isolation supports for vibration protection | Not less than | pcs. | 4 |
| 55 | Absence of wireless communication modules | Exactly | – | Present |
| 56 | Possibility of replacing cathode with filament | Exactly | – | Present |
| 57 | Possibility of replacing X-ray target (transmission target) | Exactly | – | Present |
| 58 | Built-in high-voltage generator | Exactly | – | Present |
| 59 | Capability to detect visually undetectable defects: voids, cracks, lack of wetting, missing leads inside component packages, insufficient solder fill in plated through-holes, layer misalignment in multilayer PCBs, short circuits and opens in inner layers, uneven metallization of vias; in cast parts: shrinkage cavities, voids, etc. | Exactly | – | Present |
| 60 | User authorization via built-in fingerprint scanner | Exactly | – | Present |
| 61 | Ability to save images in graphic formats: JPG, BMP, PNG, etc. | Exactly | – | Present |
| 62 | Capability to evaluate dimensions on images of inspected samples (distance, radius, curvature measurements, etc.) | Exactly | – | Present |
| 63 | Control panel with joystick and buttons for convenient positioning of sample, X-ray tube, and detector | Exactly | – | Present |
| 64 | Open-design X-ray tube with possibility of replacing cathode with filament | Exactly | – | Present |
| 65 | Possibility of replacing X-ray target | Exactly | – | Present |
| 66 | X-ray tube target must not contain toxic beryllium | Exactly | – | Present |
| 67 | Built-in high-voltage generator | Exactly | – | Present |
| 68 | Automatic electron beam focusing system based on electromagnetic lenses built into the tube | Exactly | – | Present |
| 69 | Independent software adjustment of current and voltage for X-ray intensity tuning | Exactly | – | Present |
| 70 | Control via software running on Windows 10 64-bit OS or GNU/Linux-based OS | Exactly | – | Present |
| 71 | Control via joystick, control panel buttons, keyboard and mouse; built-in monitor holder | Exactly | – | Present |
| 72 | Automatic target current and radiation intensity regulation system | Exactly | – | Present |
| 73 | Built-in digital dynamic flat-panel detector with amorphous silicon (a-Si TFT) pixel matrix | Exactly | – | Present |
| 74 | Worktable with carbon fiber insert for sample placement | Exactly | – | Present |
| 75 | Automatic centering function for inspected object on X-ray image during detector rotation and tilt | Exactly | – | Present |
| 76 | Built-in laser pointer for convenient sample positioning | Exactly | – | Present |
| 77 | Built-in navigation camera for convenient positioning of inspected sample relative to tube and detector | Exactly | – | Present |
| 78 | Two-stage integrated vacuum system for X-ray tube: turbomolecular pump with oil-free forevacuum pump | Exactly | – | Present |
| 79 | Built-in vacuum sensor in X-ray tube | Exactly | – | Present |
| 80 | USB port on control panel | Exactly | – | Present |
| 81 | Main power switch | Exactly | – | Present |
| 82 | Emergency stop button | Exactly | – | Present |
| 83 | Automatic motorized door controlled by button | Exactly | – | Present |
| 84 | Built-in transparent window in door | Exactly | – | Present |
| 85 | Built-in working area illumination | Exactly | – | Present |
| 86 | Built-in infrared sensors (light curtains) in sample loading window | Exactly | – | Present |
| 87 | Three-color signal light tower | Exactly | – | Present |
| 88 | Lead-shielded housing with personnel protection systems against X-ray radiation | Exactly | – | Present |
| 89 | Operation without connection of compressed air to the system | Exactly | – | Present |
| 90 | Module for cone-beam and planar tomography, including software | Exactly | – | Present |
| 91 | Reconstruction and analysis workstation for computed tomography | Exactly | – | Present |
| 92 | Additional computer for computed tomography | Exactly | – | Present |
| 93 | Specialized software for 3D visualization of tomographic scanning results | Exactly | – | Present |
| 94 | Function for automatic X-ray shutdown after 5 minutes of software inactivity | Exactly | – | Present |
| 95 | Automatic X-ray shutdown upon door opening | Exactly | – | Present |
| 96 | Software enabling: | Exactly | – | Present |
| • Analysis area mapping; | ||||
| • Automatic void area calculation in solder joints; | ||||
| • Image quality adjustment via graphic filters; | ||||
| • Programming the system for automatic X-ray image acquisition; | ||||
| • Creating custom filters and image processing algorithms; | ||||
| • 3D image construction and analysis in CT mode; | ||||
| • Geometric measurements; | ||||
| • Adding marks and comments during analysis; | ||||
| • Cone-beam computed tomography; | ||||
| • Planar computed tomography; | ||||
| • Automatic report generation; | ||||
| • Programming the system for automatic X-ray image acquisition; | ||||
| • Adding explanatory text inserts and pictograms to images; | ||||
| • Control of X-ray tube electrical parameters |
*Overall dimensions are determined by the workshop dimensions of PJSC "Signal" where the equipment will be installed.
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