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KOREA SEC 3D XARY EYE S160F (Ⅲ)
X-ray Inspection System with Computed Tomography Module
Part 5 : REQUIREMENTS FOR PACKAGING, MARKING, AND SHIPMENT OF EQUIPMENT
5.1. The Supplier supplies the Equipment in packaging ensuring its complete preservation during transportation. Packaging cost is included in the Equipment price. Each Equipment item must contain marking, manufacturer's label, and manufacturer's trademark.
5.2. Equipment must be supplied in special packaging complying with standards, Technical Specifications, and mandatory rules/requirements for containers and packaging. Packaging must ensure complete preservation of the Equipment throughout its transportation, including transshipments and long-term storage.
5.3. Equipment must be shipped in packaging ensuring complete preservation from all types of damage and corrosion during transportation by any means of transport, considering multiple transshipments en route. Packaging must ensure Equipment preservation during transportation and unloading at the Buyer's premises.
5.4. If necessary, technological Equipment and its components must be equipped with devices for securing moving parts to exclude their movement during transportation.
5.5. Technological Equipment, as well as all assemblies and elements in transport packaging, must be stable. Unintentional tipping, falling, or displacement of the Equipment or its components in packaged form is not permitted.
5.6. For imported Equipment, upon Buyer's request, the Supplier provides documents (instructions and/or other information) related to the supplied Equipment, certified by signature and seal.
5.7. The Supplier must provide the Buyer with original accompanying documents for the Equipment, namely:
Invoice (if applicable);
Goods Delivery Note (TORGS-12 form) or Universal Transfer Document based on invoice form per FNS letter dated October 21, 2013 No. MMV-20-3/96@;
Act of Completed Installation Works; Act of Completed Commissioning Works; Act of Personnel Training; Equipment Acceptance Certificate;
Payment invoice.
5.8. Equipment shipment is carried out by the Supplier and/or with involvement of freight companies at the Supplier's expense to the Buyer's warehouse.
5.9. The Supplier undertakes to supply the Equipment with necessary technical documentation in electronic and paper format: a) Technical maintenance manual for the Equipment; b) Operation manual; c) Technical maintenance manual; d) List of fast-wearing spare parts; e) List of possible malfunctions and methods for their elimination.
Part 6: EQUIPMENT SUPPLY PROCEDURE
6.1. Equipment supply is carried out by the Supplier to the Buyer's warehouse at the Supplier's expense on business days, with notification to the Buyer no later than 24 (twenty-four) hours before arrival of the Equipment at the address specified in clause 6.2.
6.2. Buyer's address: 355037, Stavropol Krai, Stavropol, 2nd Yugo-Zapadny Lane, Building 9A.
6.3. The Supplier arrives at the Buyer's location within 5 business days after Equipment delivery. Works specified in Section 7 of this Technical Specification must be completed within 3 business days.
Part 7: REQUIREMENTS FOR ACCOMPANYING WORKS (SERVICES)
7.1. The Supplier performs the following works accompanying the Equipment supply:
7.1.1. Equipment Installation, including Commissioning Works, according to the following plan:
- Inspection of packaging integrity for defects and internal damage;
- Unpacking and verification of supplied Equipment completeness;
- Visual inspection of Equipment;
- Installation, assembly, and connection of main units and peripheral devices;
- Connection of Equipment to power supplies;
- Verification and adjustment of main Equipment units, as well as verification of peripheral devices operability.
7.1.2. Commissioning Works according to the following plan: Test items for works are provided by the Buyer. Test items include:
- Board with BGA-type microcircuit (3 pcs.);
- Board with QFN-type microcircuit (3 pcs.);
- Board with SNP-type connector (3 pcs.);
- And/or other items at the Buyer's discretion.
Quality of X-ray images of detected defects must be no worse than examples shown in Figures 1–10 in Appendix 1 to the Technical Specification. By agreement with the Buyer, other test items provided by the Supplier containing soldered electrical connections may be used.
Additionally, CT analysis of the internal structure of a BGA-type microcircuit is performed with construction of a 3D model of the solder bump area (500 × 500 µm) demonstrating the declared resolution capability of the Equipment. By agreement with the Buyer, other test items may be used.
During operation, the Supplier confirms safe X-ray radiation level – less than 1 µSv/h at any point 100 mm from the Equipment housing at maximum operating parameters – using a high-sensitivity radiometer or dosimeter registered in the State Register of Measuring Instruments and verified/certified in an accredited laboratory.
7.1.3. Personnel Training and Briefing on Equipment operation according to the following procedure:
Training and Briefing Program:
2D Operation Mode:
Basics of X-ray Defectoscopy:
- Principles of X-ray generation;
- Material absorption properties;
- Digital detector. Duration: not less than 1 hour.
Safety Issues:
- Operator safety techniques. Duration: not less than 0.5 hours.
X-ray Installation Device:
- Device, main units and mechanisms;
- Control panel;
- Installation power on/off;
- Initialization and warm-up of X-ray tube. Duration: not less than 1.5 hours.
Software:
- Familiarization with program interface;
- Working area, histogram, navigation panel;
- Operating modes – snapshot, live image;
- Selection of voltage and current depending on inspected object;
- Methods for reducing detector noise;
- Contrast adjustment;
- Setting image scale (detector field of view);
- Performing elementary evaluative measurements: by two/three points, CNC-assisted measurement;
- Using filters;
- Macros. Duration: not less than 8 hours.
Modules:
- VC module;
- Creating automatic programs. Duration: not less than 4 hours.
3D Operation Mode:
Basics of X-ray Computed Tomography:
- Geometric magnification, voxel size;
- Dependence of voxel size on power;
- Number of projections during scanning;
- Types of artifacts during reconstruction. Duration: not less than 1 hour.
Software:
- Familiarization with program interface;
- Volume registration in coordinate system;
- Surface extraction / material separation;
- Creation and export of polygonal model;
- Measurement tools;
- Analysis tools;
- Optimization of volume file size. Duration: not less than 6 hours.
Technical Maintenance:
- Frequency and stages of maintenance;
- Control and adjustment of high-voltage cable, lubrication of cable tips;
- Lubrication of ball screws and linear guides;
- Target rotation and replacement;
- Cathode replacement in X-ray tube. Duration: not less than 4 hours.
Total training duration: not less than 26 hours.
Group size for training: not less than 10 (ten) persons (6 technologists, 2 operators, 2 repair service specialists).
Briefing of personnel (2 repair service specialists) on technical maintenance and troubleshooting of the Equipment: not less than 4 hours.
Upon completion of training and briefing, an Act is drawn up per the form of Appendix No. __.
7.2. Works are performed in accordance with requirements of: [to be specified].
Part 8: OTHER REQUIREMENTS
8.1. Equipment may be operated at ambient temperature from +5°C to +35°C and air humidity up to 70% at 20°C.
8.2. Equipment must be supplied fully complete for installation at PJSC "Signal" premises.
APPENDIX NO. 1
to the Technical Specification for Supply of X-ray Inspection System
Examples of Defects
| Figure 1 – Voids under QFN-type microcircuit housing | Figure 2 – Voids in solder joint |
| Figure 3 – Voids in solder joint of BGA-type microcircuit | Figure 4 – Solder bridges in solder joints |
| Figure 5 – Solder flow-through in surface mount | Figure 6 – Contact pad of solder joint with BGA microcircuit and PCB |
| Figure 7 – TNT technology | Figure 8 – Three-ring effect |
| Figure 9 – HiP defect | Figure 10 – Micro-welding quality |
| Figure 11 – 3D model of solder bumps | Figure 11 – 3D model of solder bumps (duplicate) |